Mitsubishi Electric introduces four trench SiC-MOSFET bare dies for embedded power electronics, targeting lower losses and stable performance in EV inverters, chargers and renewable energy systems.
Microchip Technology introduces MIL-PRF-19500-qualified plastic transient voltage suppressors to address weight, cost, and reliability requirements in aerospace and defense electronics.
Silicone-based thermal interface materials target low-pressure, high-tolerance assemblies, with ASTM D5470 thermal impedance data for electronics and automotive modules.
Electro Rent, a leading global provider in test equipment and technology solutions, celebrates 60 years of helping engineers, innovators, and procurement teams bring ideas to life with greater speed, flexibility, and confidence.
Melexis has announced that Leapers Semiconductor is integrating the Melexis MLX91299 silicon-based RC snubber into its next-generation power modules, strengthening performance and reliability for automotive and energy applications.
RANsemi Limited and Radisys Corporation have announced an expanded collaboration to deliver secure, resilient, and rapidly deployable 5G systems for tactical and mission-critical communications.