04 {{ "2026-05-04T00:00:00+00:00" | date "MMM" }} '26

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SALICRU News

Redefining Electrical Protection for Data Centers and Critical Infrastructure

Developments in telecommunications and artificial intelligence drive specialized power protection requirements for cloud and edge computing architectures.

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27 {{ "2026-04-27T00:00:00+00:00" | date "MMM" }} '26

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Zel Components News

Resilient Electronics Distribution Through Multi-Source Networks

Zel Components explains how alternative distribution models address supply chain volatility and improve sourcing flexibility in electronic component procurement.

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20 {{ "2026-04-20T00:00:00+00:00" | date "MMM" }} '26

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Teledyne SP Devices

Enabling High-Speed Swept-Source OCT with Advanced Data Acquisition

Optical coherence tomography (OCT) has become an essential tool in modern medical imaging, with swept-source OCT (SS-OCT) emerging as a leading modality because of its superior imaging speed, depth penetration, and sensitivity. By employing swept laser sources, SS-OCT enables high-resolution, real-time visualization of tissue microstructures, making it particularly valuable in applications such as ophthalmology, cardiology, dermatology and dental imaging.

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14 {{ "2026-04-14T00:00:00+00:00" | date "MMM" }} '26

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MEDIAWORLD

Electronic Design: What Is a Process Design Kit?

The Process Design Kit (PDK) forms the essential technical foundation for designing an integrated circuit that can be manufactured using a given fabrication process.

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12 {{ "2026-03-12T00:00:00+00:00" | date "MMM" }} '26

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Inmoco News

Motion profile selection in precision motion control

INMOCO outlines how trajectory design choices influence positioning accuracy, machine throughput and stability across servo-driven automation and digital supply chain equipment.

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10 {{ "2026-03-10T00:00:00+00:00" | date "MMM" }} '26

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MEDIAWORLD

DTCO: Co-optimising Design and Technology at the Heart of Advanced Semiconductors

The so-called Design-Technology Co-Optimization (DTCO) approach has become a central element in the development of next-generation integrated circuits and associated electronic architectures.

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04 {{ "2026-02-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-04T00:00:00+00:00" | date "longDate" }}

Teledyne SP Devices

Satellite monitoring systems for real-time RF intelligence

How high-speed digitization and edge processing from Teledyne SP Devices enable scalable satellite signal monitoring across multiple frequency bands.

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01 {{ "2025-12-01T00:00:00+00:00" | date "MMM" }} '25

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MEDIAWORLD

How does solar radiation disrupt electronic systems and what solutions can protect them?

Here are some key points to understand this phenomenon and the solutions to implement.

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20 {{ "2025-10-20T00:00:00+00:00" | date "MMM" }} '25

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BASLER News

Basler Enhances Probe Card Inspection with Advanced Vision & Autofocus Solutions

High-precision vision systems deliver micron-level defect detection, optimized illumination, and integrated autofocus to ensure probe card reliability in advanced wafer testing.

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07 {{ "2025-10-07T00:00:00+00:00" | date "MMM" }} '25

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Leuze

Leuze Technology Report Supercaps: Energy meets efficiency

In industry, especially in warehouse logistics, a stable power supply is essential, as demonstrated by its importance in mobile applications like hand-held scanners. Supercapacitors (supercaps) provide energy storage solutions that intelligently complement conventional battery concepts. Leuze makes targeted use of the technology in its innovative sensor solutions.

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Developments in telecommunications and artificial intelligence drive specialized power protection requirements for cloud and edge computing architectures.

Zel Components explains how alternative distribution models address supply chain volatility and improve sourcing flexibility in electronic component procurement.

The Process Design Kit (PDK) forms the essential technical foundation for designing an integrated circuit that can be manufactured using a given fabrication process.

INMOCO outlines how trajectory design choices influence positioning accuracy, machine throughput and stability across servo-driven automation and digital supply chain equipment.

The so-called Design-Technology Co-Optimization (DTCO) approach has become a central element in the development of next-generation integrated circuits and associated electronic architectures.

How high-speed digitization and edge processing from Teledyne SP Devices enable scalable satellite signal monitoring across multiple frequency bands.

Here are some key points to understand this phenomenon and the solutions to implement.

High-precision vision systems deliver micron-level defect detection, optimized illumination, and integrated autofocus to ensure probe card reliability in advanced wafer testing.

International