17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

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Teledyne SP Devices

High-Speed Data Acquisition Made Simple: Introducing the ADQ3-USB Digitizer Series

Teledyne SP Devices has expanded its 12-bit ADQ3-series digitizer lineup with a powerful new addition: the ADQ3-USB.

Read more…

17 {{ "2025-09-17T00:00:00+00:00" | date "MMM" }} '25

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Rohm Semiconductors News

ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

Enhanced thermal performance, reduced inductance, and 2.3x higher power density with flexible half-bridge and common-source topologies for next-generation PV inverters, UPS, and multi-level power circuits.

Read more…

15 {{ "2025-09-15T00:00:00+00:00" | date "MMM" }} '25

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Pickering Electronics News

Pickering Showcases High Voltage Reed Relays at electronica India 2025

Pickering Electronics will showcase its customizable Series 600 high voltage reed relays for instrumentation, ATE, and semiconductor testing at electronica India in Bengaluru from September 17 to 19, 2025.

Read more…

15 {{ "2025-09-15T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-15T00:00:00+00:00" | date "longDate" }}

SVS-vistek News

SVS-Vistek SWIR Cameras Enhance Semiconductor Yield with Subsurface Inspection

SVS-Vistek's SenSWIR FXO cameras use a 400-1700 nm range to identify subsurface wafer flaws, offering 5.2MP resolution and TEC cooling for high-speed inspection.

Read more…

12 {{ "2025-09-12T00:00:00+00:00" | date "MMM" }} '25

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Mitsubishi Electric News

Mitsubishi Electric to Ship DIPIPM Samples

Utilizing RC-IGBTs, the new Mitsubishi Electric DIPIPM module's footprint is nearly 53% smaller than conventional Mini DIPIPM Ver.7 series, enabling more compact designs.

Read more…

12 {{ "2025-09-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-12T00:00:00+00:00" | date "longDate" }}

LEMO

LEMO LAUNCHES RUGGED, MINIATURE OPTIMA D SERIES CONNECTORS FOR MISSION-CRITICAL SYSTEMS

LEMO introduces the OPTIMA D Series, a compact and rugged connector platform engineered for performance in the most demanding environments.

Read more…

12 {{ "2025-09-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-12T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Achieves World’s First HBM4 Development, Prepares Mass Production

HBM4 doubles bandwidth with 2,048 I/O terminals, improves power efficiency 40%, surpasses 10Gbps speed, boosting AI service performance 69%.

Read more…

11 {{ "2025-09-11T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-11T00:00:00+00:00" | date "longDate" }}

Microchip News

Deca and Silicon Storage Technology Partner to Deliver NVM Chiplet Solutions

Deca and SST, a Microchip subsidiary, combine SuperFlash, M-Series fan-out, and Adaptive Patterning technologies to deliver modular NVM chiplets for scalable, efficient multi-die semiconductor architectures.

Read more…

11 {{ "2025-09-11T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-11T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon Unveils 12kW High-Density PSU Reference Design for AI Data Centers

Infineon’s 12kW PSU reference design combines CoolSiC/CoolGaN technologies for 99% efficiency and 113 W/in³ density in AI data centers.

Read more…

11 {{ "2025-09-11T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-09-11T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

Silicon Labs FG23L Wireless SoC Launches with Secure Long-Range IoT

FG23L SoC offers ~146 dB link budget, +20 dBm power, 78 MHz Cortex-M33 core, enabling 10+ years IoT battery life.

Read more…

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

High-Speed Data Acquisition Made Simple: Introducing the ADQ3-USB Digitizer Series

Teledyne SP Devices has expanded its 12-bit ADQ3-series digitizer lineup with a powerful new addition: the ADQ3-USB.

ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

Enhanced thermal performance, reduced inductance, and 2.3x higher power density with flexible half-bridge and common-source topologies for next-generation PV inverters, UPS, and multi-level power circuits.

Pickering Showcases High Voltage Reed Relays at electronica India 2025

Pickering Electronics will showcase its customizable Series 600 high voltage reed relays for instrumentation, ATE, and semiconductor testing at electronica India in Bengaluru from September 17 to 19, 2025.

SVS-Vistek SWIR Cameras Enhance Semiconductor Yield with Subsurface Inspection

SVS-Vistek's SenSWIR FXO cameras use a 400-1700 nm range to identify subsurface wafer flaws, offering 5.2MP resolution and TEC cooling for high-speed inspection.

Mitsubishi Electric to Ship DIPIPM Samples

Utilizing RC-IGBTs, the new Mitsubishi Electric DIPIPM module's footprint is nearly 53% smaller than conventional Mini DIPIPM Ver.7 series, enabling more compact designs.

LEMO LAUNCHES RUGGED, MINIATURE OPTIMA D SERIES CONNECTORS FOR MISSION-CRITICAL SYSTEMS

LEMO introduces the OPTIMA D Series, a compact and rugged connector platform engineered for performance in the most demanding environments.

SK hynix Achieves World’s First HBM4 Development, Prepares Mass Production

HBM4 doubles bandwidth with 2,048 I/O terminals, improves power efficiency 40%, surpasses 10Gbps speed, boosting AI service performance 69%.

Deca and Silicon Storage Technology Partner to Deliver NVM Chiplet Solutions

Deca and SST, a Microchip subsidiary, combine SuperFlash, M-Series fan-out, and Adaptive Patterning technologies to deliver modular NVM chiplets for scalable, efficient multi-die semiconductor architectures.

Infineon Unveils 12kW High-Density PSU Reference Design for AI Data Centers

Infineon’s 12kW PSU reference design combines CoolSiC/CoolGaN technologies for 99% efficiency and 113 W/in³ density in AI data centers.

Silicon Labs FG23L Wireless SoC Launches with Secure Long-Range IoT

FG23L SoC offers ~146 dB link budget, +20 dBm power, 78 MHz Cortex-M33 core, enabling 10+ years IoT battery life.

International