Leuze expands its portfolio with the DCR 100i series, a compact code reader designed for reliable 1D, 2D and DPM code detection across variable working distances and high process speeds.
IDS strengthens its market position with double-digit growth targets, an expanded product roadmap in AI, 3D and monitoring cameras, and a new three-year manufacturer’s warranty.
NVIDIA’s BioNeMo platform is being adopted by pharmaceutical companies and research organizations to integrate AI models, laboratory data and automation for scalable, data-driven drug discovery.
A new IoT solution combining NXP's i.MX processors and connectivity to streamline design and accelerate smarter, industrial-grade edge device development.
A manufacturing and packaging collaboration in India targets automotive-grade power devices and aims to strengthen a region-based semiconductor supply chain.
A new single-chip connectivity platform targets low-power IoT deployments by combining 20 MHz Wi-Fi 7, multi-protocol support, and robust operation in congested wireless environments.
The new embedded controller firmware will strengthen secure boot, power sequencing and system orchestration for compact AI supercomputing environments.
Anritsu and VTT Technical Research Centre of Finland validate beam-steering transmitarray technology for multi-gigabit D-band wireless links under realistic over-the-air conditions.
Keysight Technologies and Samsung Electronics demonstrate a standards-based satellite-to-satellite NR-NTN connection at CES 2026, validating 3GPP Release 19 band n252 for direct-to-cell services.
congatec broadens its module offering after integrating Kontron’s JUMPtec business, creating the industry’s most extensive COM-HPC, COM Express, SMARC, and Qseven portfolio.