23 {{ "2025-05-23T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-23T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Develops UFS 4.1 Solution Based on 321-High NAND

Optimized for on-device AI, this 15% thinner, low-power solution features the world's highest 321-layer product, boosting SK hynix's leadership in AI memory for flagship smartphones.

Read more…

22 {{ "2025-05-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-22T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Diode Model Based on Measurement Data

Würth Elektronik, in cooperation with the Institute of Electronics (IFE) at Graz University of Technology, now offers an LTspice model for its TVS diodes and ESD suppressors for ESD protection, based on real measurement data using TLP.

Read more…

22 {{ "2025-05-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-22T00:00:00+00:00" | date "longDate" }}

TDK News

TDK offers tiny 0201 inductors for high-frequency circuits

Proprietary 0201-size components with high-frequency capabilities, leveraging advanced structuring and sintering tech, offering finely tuned inductors in multi-layered formats, operating from -55°C to +125°C.

Read more…

22 {{ "2025-05-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-22T00:00:00+00:00" | date "longDate" }}

Siemens digital Industry Software News

Siemens democratizes AI-driven PCB design for small and medium electronics teams

New PADS Pro Essentials and Xpedition Standard software offer SMBs professional, AI-powered, collaborative PCB design, accelerating cycles and reducing risk.

Read more…

22 {{ "2025-05-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-22T00:00:00+00:00" | date "longDate" }}

Qualcomm News

Qualcomm, Aetina, & Data Systems to Showcase AI Agent Integration Capabilities

At COMPUTEX 2025, the companies will showcase an Enterprise AI Assistant that automates document processing, boosts efficiency 96%, and integrates ERP systems.

Read more…

22 {{ "2025-05-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-22T00:00:00+00:00" | date "longDate" }}

AMD News

Red Hat, AMD expand AI, virtualization choices in hybrid cloud

Red Hat and AMD power AI inference with vLLM on Instinct GPUs, while OpenShift Virtualization on EPYC CPUs modernizes systems for future innovations.

Read more…

22 {{ "2025-05-22T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-22T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicro IO-Link dev kit simplifies industrial device node creation

ST’s P-NUCLEO-IOD5A1 IO-Link kit includes all hardware and software needed to quickly develop, evaluate, and configure smart sensors and actuators.

Read more…

21 {{ "2025-05-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-21T00:00:00+00:00" | date "longDate" }}

Toshiba News

Ultra-compact DFN8x8 packaged 650V SiC MOSFETs from Toshiba enhance power density and efficiency in industrial equipment

Low figure of merit (RDS(ON) x Qgd) contributes to higher efficiency, pushing the performance envelope of high-voltage power system designs.

Read more…

21 {{ "2025-05-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-21T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon to transform AI server power architecture with NVIDIA

Infineon and NVIDIA develop 800 V HVDC architecture to boost efficiency, reliability, and set new power delivery standards for AI data centers.

Read more…

21 {{ "2025-05-21T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-05-21T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip's cost-optimized PolarFire FPGAs and SoCs deliver high performance at a 30% lower price

For critical applications like automotive, industrial, and defense, PolarFire Core families offer SEU immunity and integrate a 64-bit RISC-V MPU for flexible computing.

Read more…

Optimized for on-device AI, this 15% thinner, low-power solution features the world's highest 321-layer product, boosting SK hynix's leadership in AI memory for flagship smartphones.

Würth Elektronik, in cooperation with the Institute of Electronics (IFE) at Graz University of Technology, now offers an LTspice model for its TVS diodes and ESD suppressors for ESD protection, based on real measurement data using TLP.

Proprietary 0201-size components with high-frequency capabilities, leveraging advanced structuring and sintering tech, offering finely tuned inductors in multi-layered formats, operating from -55°C to +125°C.

New PADS Pro Essentials and Xpedition Standard software offer SMBs professional, AI-powered, collaborative PCB design, accelerating cycles and reducing risk.

At COMPUTEX 2025, the companies will showcase an Enterprise AI Assistant that automates document processing, boosts efficiency 96%, and integrates ERP systems.

Red Hat and AMD power AI inference with vLLM on Instinct GPUs, while OpenShift Virtualization on EPYC CPUs modernizes systems for future innovations.

ST’s P-NUCLEO-IOD5A1 IO-Link kit includes all hardware and software needed to quickly develop, evaluate, and configure smart sensors and actuators.

Low figure of merit (RDS(ON) x Qgd) contributes to higher efficiency, pushing the performance envelope of high-voltage power system designs.

Infineon and NVIDIA develop 800 V HVDC architecture to boost efficiency, reliability, and set new power delivery standards for AI data centers.

For critical applications like automotive, industrial, and defense, PolarFire Core families offer SEU immunity and integrate a 64-bit RISC-V MPU for flexible computing.

International