22
'26
Written on
CEA Leti News
22
'26
Written on
Anritsu News
Web-Based Platform for Mobile Device Testing
Anritsu introduces TestDeck to centralize test operations and data management for communication test and measurement systems.
21
'26
Written on
Congatec News
High-Efficiency Embedded AI Module for Industrial Edge Systems
Congatec expands industrial embedded computing with AMD-based COM Express modules for rugged, scalable edge AI applications.
21
'26
Written on
TDK News
TDK expands its high-temperature MEMS accelerometer portfolio for energy market applications
The new AXO315T1 supports high-temperature downhole sensing, offering digital inclination measurement for MWD tools operating reliably under extreme thermal and vibration conditions.
21
'26
Written on
IDS Imaging Development Systems GmbH
IDS introduces a voluntary 3-year manufacturer’s warranty across all industrial camera series
Maximum security and long-term investment protection for machine vision projects.
21
'26
Written on
ASMPT News
ASMPT introduces the SIPLACE V platform, redefining high-performance SMT placement
Up to 30% higher output with maximum flexibility, compact footprint, and long-term investment protection.
20
'26
Written on
TDK News
High-Temperature DC Link Capacitors for Power Electronics
New ModCap UHP series from TDK Corporation enables continuous high-current performance in demanding converter environments.
20
'26
Written on
Infineon News
Infineon targets secure USB 2.0 peripheral controllers
Designed for USB Hi-Speed peripherals, the new controller adds security hardware, DMA support, and large on-chip buffering for data-intensive devices.
20
'26
Written on
Microchip News
PolarFire FPGA Video Ecosystem Enhances High-Bandwidth Embedded Vision Designs
Expansion of PolarFire FPGA smart embedded video ecosystem by Microchip Technology supports low-power, high-resolution video connectivity for medical, industrial and robotic vision systems.
20
'26
Written on
Toshiba News
