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Rohm Semiconductors News
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Melexis News
Melexis Unveils High-Resolution 22-Bit Inductive Encoder
The MLX90520 fulfils the demand for high-accuracy, cost-effective position sensing in robotics and large machinery joints with diameters between 20 and 200mm.
23
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Samsung News
Efficient Thermal Path Design in Mobile Application Processor Packaging
Samsung Electronics advances mobile processor thermal architecture to support sustained performance in compact devices, integrating Heat Path Block to optimize heat dissipation for modern workloads.
23
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Toshiba News
Toshiba Unveils New Stepper Motor Driver with Advanced Microstep Technology
Toshiba's new driver IC also features ADMD for higher speed, plus overcurrent, thermal, and stall detection to ensure motor safety and prevent system damage.
22
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Diodes Incorporated News
Dual-channel digital isolators raise breakdown voltage beyond 12kV
Diodes Incorporated adds reinforced isolation support, 100 Mbps signaling, and 150 kV/µs CMTI for industrial power, energy, and data centers.
22
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ViewSonic
ViewSonic Debuts Android 16 Interactive Displays for Education
At Bett 2026, ViewSonic introduces the first Android 16-powered education displays, targeting responsive collaboration and improved classroom energy efficiency.
22
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Schmalz News
Schmalz develops ESD-safe suction cup material for electronics handling
The new material targets electronics manufacturing, combining ESD protection, low marking behavior, and thermal resistance for automated handling of sensitive components.
22
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Microchip News
Microchip Introduces 600V Gate Driver Family for High-Voltage Power Management Applications
The new devices target motor control and power conversion applications, offering high-voltage operation, noise robustness, and logic-level compatibility for industrial and consumer designs.
22
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Anritsu News
HYUNDAI MOBIS Selects Anritsu’s Hybrid eCall Test Solution
All-in-one platform boosts reliability and efficiency for next-generation automotive emergency call systems.
22
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ICsense News
