09 {{ "2026-01-09T00:00:00+00:00" | date "MMM" }} '26

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Congatec News

Congatec Expands Computer-on-Module Portfolio

congatec broadens its module offering after integrating Kontron’s JUMPtec business, creating the industry’s most extensive COM-HPC, COM Express, SMARC, and Qseven portfolio.

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08 {{ "2026-01-08T00:00:00+00:00" | date "MMM" }} '26

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ViewSonic

ViewSonic Launches Innovative LDE Series to Bring dvLED Experiences Within Reach

Designed to reduce system complexity, the LDE Series supports faster installation and lower entry barriers for system integrators and AV professionals.

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08 {{ "2026-01-08T00:00:00+00:00" | date "MMM" }} '26

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Mitutoyo Europe

Nanometric precision achieved in European coordinate metrology

Spain’s Centro Español de Metrología becomes the first in Europe to deploy Mitutoyo’s LEGEX TAKUMI, setting a new benchmark for absolute coordinate measurement accuracy.

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08 {{ "2026-01-08T00:00:00+00:00" | date "MMM" }} '26

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Keysight technologies News

AI Validation Framework for Safety-Critical Systems

Keysight Technologies introduces a lifecycle-based software platform to analyze, validate, and monitor AI behavior in regulated environments such as automotive and industrial systems.

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08 {{ "2026-01-08T00:00:00+00:00" | date "MMM" }} '26

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TDK News

TDK Expands High-Power AC-DC Portfolio with 4.5 kW Three-Phase Supply

The new TPS4500 series from TDK addresses high-voltage industrial systems requiring configurable outputs, transformer-free three-phase operation, and digitally monitored power delivery.

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08 {{ "2026-01-08T00:00:00+00:00" | date "MMM" }} '26

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Digid News

Nanoscale sensors enable pervasive temperature and force sensing

Digid qualifies printed electronics technology for volume production of micrometre-scale sensors targeting robotics, medical devices, and advanced biosensing applications.

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08 {{ "2026-01-08T00:00:00+00:00" | date "MMM" }} '26

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innodisk

Innodisk Unveils the New Computing Series with the First EXMP-Q911 COM-HPC Mini Module

The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.

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07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

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SK Hynix News

SK hynix Unveils Next-Generation AI Memory at CES 2026

From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.

Read more…

07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-07T00:00:00+00:00" | date "longDate" }}

Qualcomm News

Snapdragon X2 Plus Platform for Windows PCs

Qualcomm expands AI-centric PC silicon with multi-day battery life and balanced performance for professionals and creators.

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07 {{ "2026-01-07T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-07T00:00:00+00:00" | date "longDate" }}

Thales Group News

Post-Quantum Security Chip Advances Embedded Cryptography

Thales collaborates with Samsung Electronics to supply quantum-resistant cryptographic software for a security chip showcased at the CES 2026 technology exhibition in Las Vegas.

Read more…

congatec broadens its module offering after integrating Kontron’s JUMPtec business, creating the industry’s most extensive COM-HPC, COM Express, SMARC, and Qseven portfolio.

Designed to reduce system complexity, the LDE Series supports faster installation and lower entry barriers for system integrators and AV professionals.

Spain’s Centro Español de Metrología becomes the first in Europe to deploy Mitutoyo’s LEGEX TAKUMI, setting a new benchmark for absolute coordinate measurement accuracy.

Keysight Technologies introduces a lifecycle-based software platform to analyze, validate, and monitor AI behavior in regulated environments such as automotive and industrial systems.

The new TPS4500 series from TDK addresses high-voltage industrial systems requiring configurable outputs, transformer-free three-phase operation, and digitally monitored power delivery.

Digid qualifies printed electronics technology for volume production of micrometre-scale sensors targeting robotics, medical devices, and advanced biosensing applications.

The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.

From January 6–9, in Las Vegas, SK hynix highlights expanded AI memory portfolio with new HBM4, server-oriented modules, and NAND flash solutions to support data center and AI system demands.

Qualcomm expands AI-centric PC silicon with multi-day battery life and balanced performance for professionals and creators.

Thales collaborates with Samsung Electronics to supply quantum-resistant cryptographic software for a security chip showcased at the CES 2026 technology exhibition in Las Vegas.

International