08 {{ "2026-06-08T00:00:00+00:00" | date "MMM" }} '26

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Cosmic Semiconductor Solutions News

High-Power Semiconductor Testing Platforms for Wide Bandgap Devices

Cosmic introduces a comprehensive suite of automated testing equipment engineered to validate silicon carbide and gallium nitride components for automotive power infrastructures.

Read more…

08 {{ "2026-06-08T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-08T00:00:00+00:00" | date "longDate" }}

Cotelec News

Faradized Pneumatic Test Interfaces for High-Frequency Component Validation

COTELEC introduces a shielded electromagnetic isolation platform designed to optimize signal integrity and streamline automated testing workflows in mass-production electronics manufacturing.

Read more…

08 {{ "2026-06-08T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-08T00:00:00+00:00" | date "longDate" }}

Ni News

Emerson Broadens Affordable Access to High-Performance RF Test Systems

New NI PXI Core VST instruments deliver synchronized calibrated RF measurements for wireless, medical, academic and production applications.

Read more…

05 {{ "2026-06-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-05T00:00:00+00:00" | date "longDate" }}

Cambridge GaN Devices

650V Gallium Nitride Integrated Circuit for Electric Vehicle Powertrains

Cambridge GaN Devices introduces a semiconductor device featuring a nine-milliohm on-resistance to improve inverter efficiency and enable higher frequency switching in automotive applications.

Read more…

05 {{ "2026-06-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-05T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Releases New PCI Express Gen 7.0 Receiver Test Solution

This automated solution simplifies complex high-speed interface testing up to 128 GT/s, reducing workloads and improving design efficiency for next-generation device compliance.

Read more…

05 {{ "2026-06-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-05T00:00:00+00:00" | date "longDate" }}

Melexis News

Programmable Two-Wire Two-Bit Hall Switch for Automotive Electronics

Melexis introduces a contactless magnetic position sensor with programmable current levels and thresholds to replace mechanical microswitches in automotive body applications.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

TDK News

Low-Inductance DC-Link Capacitors for Silicon Carbide Power Electronics in Industrial Applications

TDK Corporation develops a high-frequency stable capacitor platform to reduce voltage spikes in modern energy storage and drive systems.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

Mediatek News

Multi-band uplink configuration optimizes digital infrastructure throughput performance

Samsung and MediaTek validated a five-layer uplink configuration to improve data efficiency and capacity across wireless digital infrastructure.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

MURATA News

High-Capacitance Automotive MLCCs with Soft-Termination

Murata Introduces World’s First 2.2μF/100Vdc Soft-Termination Chip Multilayer Ceramic Capacitors in 0805-inch Size for Automotive Applications.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

Infineon News

Hardware Security Integration for Autonomous Physical Artificial Intelligence Systems

Infineon Technologies and NVIDIA collaborate to implement post-quantum resilient cryptographic hardware on the Jetson Thor platform for industrial robotics applications.

Read more…

Market Overview

Overview of Silicon Carbide (SiC) Electronic Components and Modules Announced in the First Half of 2026

Technical Articles

Nanocrystalline Core Inductors for High-Frequency Power Converters

Case studies

Automated Semiconductor Reliability Testing

High-Power Semiconductor Testing Platforms for Wide Bandgap Devices

Cosmic introduces a comprehensive suite of automated testing equipment engineered to validate silicon carbide and gallium nitride components for automotive power infrastructures.

Faradized Pneumatic Test Interfaces for High-Frequency Component Validation

COTELEC introduces a shielded electromagnetic isolation platform designed to optimize signal integrity and streamline automated testing workflows in mass-production electronics manufacturing.

Emerson Broadens Affordable Access to High-Performance RF Test Systems

New NI PXI Core VST instruments deliver synchronized calibrated RF measurements for wireless, medical, academic and production applications.

650V Gallium Nitride Integrated Circuit for Electric Vehicle Powertrains

Cambridge GaN Devices introduces a semiconductor device featuring a nine-milliohm on-resistance to improve inverter efficiency and enable higher frequency switching in automotive applications.

Anritsu Releases New PCI Express Gen 7.0 Receiver Test Solution

This automated solution simplifies complex high-speed interface testing up to 128 GT/s, reducing workloads and improving design efficiency for next-generation device compliance.

Programmable Two-Wire Two-Bit Hall Switch for Automotive Electronics

Melexis introduces a contactless magnetic position sensor with programmable current levels and thresholds to replace mechanical microswitches in automotive body applications.

Low-Inductance DC-Link Capacitors for Silicon Carbide Power Electronics in Industrial Applications

TDK Corporation develops a high-frequency stable capacitor platform to reduce voltage spikes in modern energy storage and drive systems.

Multi-band uplink configuration optimizes digital infrastructure throughput performance

Samsung and MediaTek validated a five-layer uplink configuration to improve data efficiency and capacity across wireless digital infrastructure.

High-Capacitance Automotive MLCCs with Soft-Termination

Murata Introduces World’s First 2.2μF/100Vdc Soft-Termination Chip Multilayer Ceramic Capacitors in 0805-inch Size for Automotive Applications.

Hardware Security Integration for Autonomous Physical Artificial Intelligence Systems

Infineon Technologies and NVIDIA collaborate to implement post-quantum resilient cryptographic hardware on the Jetson Thor platform for industrial robotics applications.

International