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Microchip News
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Toshiba News
Copper-Clip MOSFETs Enhance Automotive Power
Toshiba introduces a 40-volt electrical switching architecture designed to increase thermal dissipation and current capacity for high-stress vehicle motor drive systems.
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Kontron News
Hardware Acceleration Unit For Mission-Critical Data Workloads
Kontron introduces a compact computing solution designed to process artificial intelligence inference and parallel calculations within harsh aerospace defense environments.
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Keysight technologies News
6G Channel Modeling for Realistic Network Simulation
Keysight Technologies, NTT DOCOMO and NTT are developing methods to evaluate future 6G wireless architectures.
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Mitsubishi Electric News
Mitsubishi Electric & Semikron Danfoss Develop New Power Module
Jointly developed 3-level standard package enhances inverter efficiency, design flexibility and standardization for industrial and renewable applications.
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Infineon News
Semiconductor Partnership for Humanoid Robot Development
Infineon and VinRobotics are collaborating to develop humanoid robot platforms using semiconductor, AI, and robotics technologies.
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Rohm Semiconductors News
Top-Side Cooling Semiconductor Packages for SiC MOSFETs
ROHM develops a surface-mount package architecture designed to maximize thermal dissipation and high-voltage insulation in automotive and industrial power conversion systems.
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Nexperia News
Top-Side Cooled Silicon Carbide MOSFETs in QDPAK
Nexperia introduced high-voltage wide-bandgap semiconductors featuring a surface-mount configuration designed to optimize thermal dissipation in power-dense systems.
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electronica Shanghai Info
electronica Shanghai Identifies 10 Key Technology Trends Shaping the Electronics Industry in 2026
From AI-powered vehicles and embodied intelligence to energy storage, 6G and smart wearables, electronica Shanghai highlights the technologies expected to drive innovation, investment and industrial transformation across the global electronics ecosystem in 2026.
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MURATA News
