Infineon and Wolfspeed are transitioning to 200-millimeter substrates to improve semiconductor manufacturing efficiency for electric vehicles and data center power systems.
Baumer is demonstrating advanced position and distance measurement technologies to optimize plant engineering and accelerate smart factory network communications.
TDK Corporation expands its surface-mount multilayer varistor family with the X series, solving transient voltage suppression and sustainability challenges in industrial electronics.
ETEL introduces a full air bearing planar platform designed to support next-generation maskless lithography and optical inspection within the semiconductor ecosystem.
Infineon showcases embedded hardware solutions for computing, sensing, and power management in robotics, software-defined vehicles, and intelligent edge infrastructure.