Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.
Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management, enabling high-power radar and communication systems that double current performance limits for military missions.
OMRON introduces PCB-mount relays designed to support high-voltage isolation and compact system integration in electric vehicle charging and energy storage applications.
Danisense introduces MK500ID current clamp-on for accurate DC and AC measurements, offering high bandwidth and phase stability for demanding power electronics applications.
Toshiba introduces DFN2020B package devices to support miniaturized automotive electronics with improved inspection capability and solder joint reliability.
Würth Elektronik introduces AEC-Q200 certified inductors utilizing nanocrystalline powder cores to enhance efficiency in high-frequency automotive power conversion and battery management systems.
Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.
Renesas Electronics develops a depletion-mode GaN device enabling simpler converter architectures for solar, EV charging and data-center power systems.
Anritsu, SK Telecom, POSTECH and Bluetest validated AI-driven antenna optimization using OTA measurements, demonstrating throughput gains in 5G MIMO configurations.