27 {{ "2026-03-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-27T00:00:00+00:00" | date "longDate" }}

Rutronik News

Thin film resistors for high-precision and stable electronics

Rutronik expands its portfolio with YAGEO’s RP series, delivering enhanced stability, environmental resistance and precision for demanding applications.

Read more…

27 {{ "2026-03-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-27T00:00:00+00:00" | date "longDate" }}

Infineon News

Power Module Boosts AI Data Center Efficiency

Infineon Technologies introduces TLVR-based quad-phase power module to deliver high current density and efficient power delivery for next-generation AI processors.

Read more…

27 {{ "2026-03-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-27T00:00:00+00:00" | date "longDate" }}

Diodes Incorporated News

MOSFETs Improve Efficiency in 48V Automotive Systems

Diodes Incorporated introduces PowerDI 8080-5 MOSFETs with ultra-low RDS(ON) to reduce losses and enhance efficiency in automotive power applications.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

MICRO EPSILON News

Inline Wafer Thickness Measurement in Confined Environments

Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

Northrop Grumman News

Northrop Grumman Harnesses Synthetic Diamonds to Power Next Generation Defense Microelectronics

Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management, enabling high-power radar and communication systems that double current performance limits for military missions.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

OMRON News

High-current DC relays for EV and energy storage

OMRON introduces PCB-mount relays designed to support high-voltage isolation and compact system integration in electric vehicle charging and energy storage applications.

Read more…

26 {{ "2026-03-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-26T00:00:00+00:00" | date "longDate" }}

Danisense News

Clamp-On Sensor Improves High-Precision Measurement

Danisense introduces MK500ID current clamp-on for accurate DC and AC measurements, offering high bandwidth and phase stability for demanding power electronics applications.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Toshiba News

Automotive MOSFETs in compact wettable flank packages

Toshiba introduces DFN2020B package devices to support miniaturized automotive electronics with improved inspection capability and solder joint reliability.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

High Power Density Inductors for Automotive Power Electronics

Würth Elektronik introduces AEC-Q200 certified inductors utilizing nanocrystalline powder cores to enhance efficiency in high-frequency automotive power conversion and battery management systems.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Introduces Hybrid MCU SiP for Automotive HMIs

Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

IDS AI imaging enables automated textile recycling sorting

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

Thin film resistors for high-precision and stable electronics

Rutronik expands its portfolio with YAGEO’s RP series, delivering enhanced stability, environmental resistance and precision for demanding applications.

Power Module Boosts AI Data Center Efficiency

Infineon Technologies introduces TLVR-based quad-phase power module to deliver high current density and efficient power delivery for next-generation AI processors.

MOSFETs Improve Efficiency in 48V Automotive Systems

Diodes Incorporated introduces PowerDI 8080-5 MOSFETs with ultra-low RDS(ON) to reduce losses and enhance efficiency in automotive power applications.

Inline Wafer Thickness Measurement in Confined Environments

Micro-Epsilon introduces a robust interferometric sensor enabling precise inline thickness measurement of silicon and silicon carbide wafers in high-contamination production processes.

Northrop Grumman Harnesses Synthetic Diamonds to Power Next Generation Defense Microelectronics

Northrop Grumman is utilizing lab-grown diamonds to enhance semiconductor thermal management, enabling high-power radar and communication systems that double current performance limits for military missions.

High-current DC relays for EV and energy storage

OMRON introduces PCB-mount relays designed to support high-voltage isolation and compact system integration in electric vehicle charging and energy storage applications.

Clamp-On Sensor Improves High-Precision Measurement

Danisense introduces MK500ID current clamp-on for accurate DC and AC measurements, offering high bandwidth and phase stability for demanding power electronics applications.

Automotive MOSFETs in compact wettable flank packages

Toshiba introduces DFN2020B package devices to support miniaturized automotive electronics with improved inspection capability and solder joint reliability.

High Power Density Inductors for Automotive Power Electronics

Würth Elektronik introduces AEC-Q200 certified inductors utilizing nanocrystalline powder cores to enhance efficiency in high-frequency automotive power conversion and battery management systems.

Microchip Introduces Hybrid MCU SiP for Automotive HMIs

Integrated processor and memory architecture supports high-resolution displays and simplifies PCB design for automotive and e-mobility interface systems.

International