13 {{ "2026-02-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-13T00:00:00+00:00" | date "longDate" }}

Aaronn Electronic GmbH news

Aaronn Integrates COM Express for Edge AI Systems

System integration approach combines congatec’s AI-enabled COM Express modules with platform-level design expertise for industrial, medical and transportation deployments.

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13 {{ "2026-02-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-13T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik Expands Portfolio with Edge AI COM Module

ADLINK-based module targets industrial edge computing with up to 40 TOPS AI performance and long-term availability.

Read more…

13 {{ "2026-02-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-13T00:00:00+00:00" | date "longDate" }}

ADLINK News

ADLINK Launches New PXI Express Platforms For Advanced Semiconductor Testing

The introduction of the PXIe-9908 SMU and PXES-2596 chassis provides high-speed, precision measurement and scalable architectures for validating complex electronic and optoelectronic components.

Read more…

13 {{ "2026-02-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-13T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Launches Compact 40V eFuse ICs For Power Line Protection

The new TCKE6 series provides advanced circuit protection in small TSOP6F packages, offering low on-resistance and high reliability for industrial and consumer electronic applications.

Read more…

13 {{ "2026-02-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-13T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron Electronics Establishes OSM Design-In Network

Program structures national partnerships to accelerate OSM-based Systems-on-Module development for embedded applications across industrial and medical sectors.

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12 {{ "2026-02-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-12T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron Highlights Edge AI and CRA-Ready Platforms at Embedded World 2026

Showcase spans Intel, AMD and Arm architectures with integrated cybersecurity and 5G connectivity for industrial edge deployments.

Read more…

12 {{ "2026-02-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-12T00:00:00+00:00" | date "longDate" }}

Infinix News

Infinix Adopts Snapdragon Platforms for NOTE 60 Series

Partnership with Qualcomm expands chipset integration across smartphones and connected devices to enhance performance, AI processing and system-level optimization.

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12 {{ "2026-02-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-12T00:00:00+00:00" | date "longDate" }}

Würth Elektronik News

Transition to Lead-Free SMT Spacers for Compliance and Assembly Efficiency

Würth Elektronik has restructured its SMT spacer portfolio to lead-free alloys, ensuring long-term compliance with RoHS environmental standards and expanding automated pick-and-place options for manufacturers.

Read more…

11 {{ "2026-02-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-11T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Engineering Data Management for AI-Ready Semiconductor Design

Keysight Technologies unveils SOS Enterprise to standardize engineering information for AI adoption across distributed design teams.

Read more…

11 {{ "2026-02-11T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-11T00:00:00+00:00" | date "longDate" }}

Anritsu News

IoT manufacturers strengthen RF and signal integrity testing

At Embedded World 2026 , Anritsu Corporation demonstrated how IoT device manufacturers use RF and signal integrity testing to improve wireless reliability and reduce redesign risks.

Read more…

Technical Articles

Satellite monitoring systems for real-time RF intelligence

Aaronn Integrates COM Express for Edge AI Systems

System integration approach combines congatec’s AI-enabled COM Express modules with platform-level design expertise for industrial, medical and transportation deployments.

Rutronik Expands Portfolio with Edge AI COM Module

ADLINK-based module targets industrial edge computing with up to 40 TOPS AI performance and long-term availability.

ADLINK Launches New PXI Express Platforms For Advanced Semiconductor Testing

The introduction of the PXIe-9908 SMU and PXES-2596 chassis provides high-speed, precision measurement and scalable architectures for validating complex electronic and optoelectronic components.

Toshiba Launches Compact 40V eFuse ICs For Power Line Protection

The new TCKE6 series provides advanced circuit protection in small TSOP6F packages, offering low on-resistance and high reliability for industrial and consumer electronic applications.

Kontron Electronics Establishes OSM Design-In Network

Program structures national partnerships to accelerate OSM-based Systems-on-Module development for embedded applications across industrial and medical sectors.

Kontron Highlights Edge AI and CRA-Ready Platforms at Embedded World 2026

Showcase spans Intel, AMD and Arm architectures with integrated cybersecurity and 5G connectivity for industrial edge deployments.

Infinix Adopts Snapdragon Platforms for NOTE 60 Series

Partnership with Qualcomm expands chipset integration across smartphones and connected devices to enhance performance, AI processing and system-level optimization.

Transition to Lead-Free SMT Spacers for Compliance and Assembly Efficiency

Würth Elektronik has restructured its SMT spacer portfolio to lead-free alloys, ensuring long-term compliance with RoHS environmental standards and expanding automated pick-and-place options for manufacturers.

Engineering Data Management for AI-Ready Semiconductor Design

Keysight Technologies unveils SOS Enterprise to standardize engineering information for AI adoption across distributed design teams.

IoT manufacturers strengthen RF and signal integrity testing

At Embedded World 2026 , Anritsu Corporation demonstrated how IoT device manufacturers use RF and signal integrity testing to improve wireless reliability and reduce redesign risks.

International