KYOCERA AVX introduces a new line of electronic components designed to mitigate mechanical stress in harsh environments by maximizing board-mounting strength.
The 2U edge AI platform is designed to simplify enterprise deployment of private LLMs, AI agents, RAG applications and multimodal AI while supporting flexible accelerator configurations.
AttoTude has reduced its design cycles by more than 50% while achieving first-pass silicon success across advanced RF, sub-THz, and THz tape-outs that underpin its guided-wave interconnect platform.
Now available at Rutronik, the kit provides an ideal platform for getting started with the new LTE Cat 1 bis module and accelerating proof-of-concept development.
ROHM introduces a redesigned semiconductor architecture to improve switching efficiency and short-circuit tolerance in electric vehicle thermal management and industrial motor drives.
AMD introduces native Universal Chiplet Interconnect Express support to modularize heterogeneous compute and radio frequency processing within unified multichip packages.
Aetina expands edge AI capabilities with NVIDIA Jetson Orin Nano 2, enabling higher-performance generative AI and multimodal inference for compact Physical AI systems.