STMicroelectronics introduces dual operational amplifiers featuring high offset stability and wide supply voltage integration for industrial and automotive signal-conditioning applications.
Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.
New module integrates Intel processors with onboard AI acceleration to support real-time edge computing in industrial automation and robotics environments.
New high-voltage common-mode choke supports compact power converters and motor drives using SiC and GaN semiconductors with improved EMI suppression and insulation performance.
Infineon components supported Artemis II mission systems, demonstrating reliability in power, control, and communication electronics under prolonged radiation exposure conditions.
Amphenol’s SOSA-aligned connector, distributed by Powell Electronics, supports high-speed embedded computing with increased density and signal integrity for defense platforms.