23 {{ "2026-04-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-23T00:00:00+00:00" | date "longDate" }}

AMD News

AMD advances desktop CPUs with dual 3D V-Cache processor

Ryzen 9 9950X3D2 integrates dual cache architecture and Zen 5 cores to improve latency, throughput and performance for development and creation workloads.

Read more…

23 {{ "2026-04-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-23T00:00:00+00:00" | date "longDate" }}

Synopsis News

Advanced Electronic Design Automation and Intellectual Property Integration for Next-Generation Process Nodes

Synopsys has expanded its collaboration with TSMC to provide AI-enhanced design flows and silicon-proven interface IP for A14, A16, and 2nm process technologies.

Read more…

23 {{ "2026-04-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-23T00:00:00+00:00" | date "longDate" }}

Antaira News

Semiconductor networking meets E187 cybersecurity standard

Antaira Technologies achieves SEMI E187 certification to strengthen secure industrial networking in semiconductor manufacturing environments.

Read more…

23 {{ "2026-04-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-23T00:00:00+00:00" | date "longDate" }}

Infineon News

Quantum chip manufacturing scales in Europe

Infineon Technologies contributes industrial expertise to European quantum pilot lines to enable scalable quantum chip production and strengthen the regional semiconductor ecosystem.

Read more…

22 {{ "2026-04-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-22T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip integrates programmable logic into low-power microcontrollers

CLB-based PIC MCUs combine hardware logic and embedded control to reduce latency, improve determinism and simplify timing-critical system design.

Read more…

22 {{ "2026-04-22T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-22T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM introduces 5th generation SiC MOSFETs for efficiency

New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.

Read more…

21 {{ "2026-04-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-21T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix advances AI servers with 192GB SOCAMM2 memory

High-density LPDDR5X module improves bandwidth and power efficiency for NVIDIA Vera Rubin platforms, addressing AI memory bottlenecks.

Read more…

21 {{ "2026-04-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-21T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

High-precision dual operational amplifiers support a wide operating voltage range

ST introduces dual operational amplifiers featuring high offset stability and wide supply voltage integration for industrial and automotive signal-conditioning applications.

Read more…

17 {{ "2026-04-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-17T00:00:00+00:00" | date "longDate" }}

Intel News

Scalable Mobile Processors for Enhanced Edge and Commercial Computing

Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.

Read more…

17 {{ "2026-04-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-04-17T00:00:00+00:00" | date "longDate" }}

Congatec News

Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units

Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.

Read more…

Technical Articles

Enabling High-Speed Swept-Source OCT with Advanced Data Acquisition

Case studies

Surface-mount production lines for automotive electronics manufacturing

AMD advances desktop CPUs with dual 3D V-Cache processor

Ryzen 9 9950X3D2 integrates dual cache architecture and Zen 5 cores to improve latency, throughput and performance for development and creation workloads.

Advanced Electronic Design Automation and Intellectual Property Integration for Next-Generation Process Nodes

Synopsys has expanded its collaboration with TSMC to provide AI-enhanced design flows and silicon-proven interface IP for A14, A16, and 2nm process technologies.

Semiconductor networking meets E187 cybersecurity standard

Antaira Technologies achieves SEMI E187 certification to strengthen secure industrial networking in semiconductor manufacturing environments.

Quantum chip manufacturing scales in Europe

Infineon Technologies contributes industrial expertise to European quantum pilot lines to enable scalable quantum chip production and strengthen the regional semiconductor ecosystem.

Microchip integrates programmable logic into low-power microcontrollers

CLB-based PIC MCUs combine hardware logic and embedded control to reduce latency, improve determinism and simplify timing-critical system design.

ROHM introduces 5th generation SiC MOSFETs for efficiency

New devices reduce on-resistance by 30% at high temperatures, improving power conversion in EVs, AI servers, and industrial systems.

SK hynix advances AI servers with 192GB SOCAMM2 memory

High-density LPDDR5X module improves bandwidth and power efficiency for NVIDIA Vera Rubin platforms, addressing AI memory bottlenecks.

High-precision dual operational amplifiers support a wide operating voltage range

ST introduces dual operational amplifiers featuring high offset stability and wide supply voltage integration for industrial and automotive signal-conditioning applications.

Scalable Mobile Processors for Enhanced Edge and Commercial Computing

Intel Corporation has launched the Core Series 3 mobile processors to provide advanced power efficiency and artificial intelligence capabilities for value-tier laptops and edge devices.

Low-Power Computer-on-Modules Integrate Dedicated Neural Processing Units

Congatec utilizes Intel Core Series 3 processors to bring high-performance artificial intelligence acceleration to cost-sensitive industrial edge applications.

International