Infineon has successfully fabricated functional power devices on larger wafer formats, expanding wide-bandgap production capacity for automotive and industrial energy conversion systems.
Three tech leaders combine advanced networking, custom processors, and data centers to build Korea’s next-generation sovereign infrastructure for high-performance and energy-efficient artificial intelligence computing.
Festo Integrated Automation Solutions optimize front-end wafer transfer and chamber motion control to minimize particle contamination and footprint in cleanroom environments.
Partnering with IBM and Oak Ridge National Laboratory, the company delivers essential classical infrastructure, advanced processors, and open software to advance hybrid quantum error correction.
ST87M01 modules introduce SoftSIM integration, factory-level SGP.32 remote profile provisioning, and open-source Zephyr compatibility to simplify supply chains and streamline development for industrial IoT applications.
Vertiv and Infineon Technologies AG have partnered to integrate advanced power semiconductors into high-voltage distribution systems for artificial intelligence data centers.
FUCHS Lubricants Co. has introduced a portfolio of thermal interface materials designed to optimize heat dissipation in power electronics and semiconductor devices.