Infineon Technologies has developed a ready-to-integrate hardware and software architecture to enable digital card tokenization and near-field communication transactions on wearable computing devices.
Toshiba expanded its semiconductor portfolio with ten new quad-channel high-speed standard digital isolators designed for high-temperature industrial equipment.
Würth Elektronik ICS will present high-voltage power distribution and electronic control systems for mobile machinery and commercial vehicles at iVT Expo 2026 in Cologne.
Anritsu provides the spectrum analyzer hardware technology, while YOTASYS acts as system integrator, combining Anritsu’s RF hardware with its own AI, software and GPU-based processing capabilities.
Broadcom and Samsung Electronics collaborate on a new broadband-optimized fixed wireless access reference platform integrating Broadcom’s BCM6776 Wi-Fi 8 SoC with Samsung’s B1320 5G Modem.