01 {{ "2026-06-01T00:00:00+00:00" | date "MMM" }} '26

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STMicroelectronics News

Automotive inertial module improves GNSS positioning accuracy

STMicroelectronics introduces a high-temperature automotive IMU combining synchronized MEMS sensing and sensor fusion support for navigation, telematics and vehicle motion analysis.

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01 {{ "2026-06-01T00:00:00+00:00" | date "MMM" }} '26

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Samsung News

HBM4E memory samples target next-generation AI infrastructure

Samsung Electronics begins shipment of 12-layer HBM4E samples with higher bandwidth, improved energy efficiency and expanded memory capacity for AI computing platforms.

Read more…

01 {{ "2026-06-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-01T00:00:00+00:00" | date "longDate" }}

CeramTec News

CeramTec at PCIM Expo 2026

From 9 to 11 June, in Nuremberg, discover high-performance silicon nitride and Rubalit 710 C solutions for e-mobility, high-voltage, and high-frequency electronics backed by a reliable European supply chain.

Read more…

01 {{ "2026-06-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-01T00:00:00+00:00" | date "longDate" }}

Cognex Germany Inc

Cognex OneVision Adoption Ramps as Manufacturers Scale AI Vision Globally

Customers report faster deployment, improved throughput, and new levels of collaboration.

Read more…

01 {{ "2026-06-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-01T00:00:00+00:00" | date "longDate" }}

CEA Leti News

3D Chip Stacking Advances AI Interconnect Density

CEA-Leti demonstrates ultra-fine die-to-wafer hybrid bonding technology designed to improve bandwidth and energy efficiency in advanced computing systems.

Read more…

01 {{ "2026-06-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-01T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Introduces Cost-Optimized Real-Time Control DSCs

The new controller family targets embedded control applications by combining deterministic processing, integrated analog functions, and automotive-grade reliability in a single device.

Read more…

01 {{ "2026-06-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-01T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon Joins NVIDIA Ecosystem for 800 VDC AI Power Delivery

Infineon provides semiconductor power management solutions for the NVIDIA modular MGX architecture to optimize energy distribution in high-density accelerated computing data centers.

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01 {{ "2026-06-01T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-01T00:00:00+00:00" | date "longDate" }}

Mitutoyo Europe

Méca-Précis optimises control processes using robotic measurement cells

Méca-Précis implements a robotic measurement cell from Mitutoyo to streamline its inspection processes.

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30 {{ "2026-05-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-30T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Integrated Optical Wireless Quantum Key Distribution Security Stack

Fraunhofer IPMS and partners have developed a wireless quantum-secure communication system combining light fidelity and quantum key distribution for critical infrastructure.

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30 {{ "2026-05-30T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-30T00:00:00+00:00" | date "longDate" }}

MICRO EPSILON News

Vacuum Sensor Technology for High-Precision Industrial Measurement Tasks

Micro-Epsilon configures non-contact sensors for measurements in the semiconductor industry, optics, and aviation.

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Technical Articles

Ki Wireless Docking and Charging for Humanoid Robots

Case studies

Wireless test infrastructure expands device certification

Automotive inertial module improves GNSS positioning accuracy

STMicroelectronics introduces a high-temperature automotive IMU combining synchronized MEMS sensing and sensor fusion support for navigation, telematics and vehicle motion analysis.

HBM4E memory samples target next-generation AI infrastructure

Samsung Electronics begins shipment of 12-layer HBM4E samples with higher bandwidth, improved energy efficiency and expanded memory capacity for AI computing platforms.

CeramTec at PCIM Expo 2026

From 9 to 11 June, in Nuremberg, discover high-performance silicon nitride and Rubalit 710 C solutions for e-mobility, high-voltage, and high-frequency electronics backed by a reliable European supply chain.

Cognex OneVision Adoption Ramps as Manufacturers Scale AI Vision Globally

Customers report faster deployment, improved throughput, and new levels of collaboration.

3D Chip Stacking Advances AI Interconnect Density

CEA-Leti demonstrates ultra-fine die-to-wafer hybrid bonding technology designed to improve bandwidth and energy efficiency in advanced computing systems.

Microchip Introduces Cost-Optimized Real-Time Control DSCs

The new controller family targets embedded control applications by combining deterministic processing, integrated analog functions, and automotive-grade reliability in a single device.

Infineon Joins NVIDIA Ecosystem for 800 VDC AI Power Delivery

Infineon provides semiconductor power management solutions for the NVIDIA modular MGX architecture to optimize energy distribution in high-density accelerated computing data centers.

Méca-Précis optimises control processes using robotic measurement cells

Méca-Précis implements a robotic measurement cell from Mitutoyo to streamline its inspection processes.

Integrated Optical Wireless Quantum Key Distribution Security Stack

Fraunhofer IPMS and partners have developed a wireless quantum-secure communication system combining light fidelity and quantum key distribution for critical infrastructure.

Vacuum Sensor Technology for High-Precision Industrial Measurement Tasks

Micro-Epsilon configures non-contact sensors for measurements in the semiconductor industry, optics, and aviation.

International