27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Infineon News

Integrated 600 V GaN Half-Bridge Simplifies Power Design

Infineon introduces compact driver-integrated power stage for motor drives and switched-mode supplies requiring efficient high-frequency conversion.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Sysgo News

Embedded Platforms Align With Cyber Resilience Regulation

SYSGO will present virtualization-based real-time architectures at Embedded World 2026 to support certifiable safety and cybersecurity requirements in connected embedded systems.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

75V Motor Driver ICs Target 48V Industrial Systems

STMicroelectronics introduces scalable motor-control chips supporting multiple motor types and up to 500 W applications across automation and electromechanical equipment.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Teledyne Flir OEM

Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology

Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Toshiba News

Compact Automotive Power Management IC Enhances Redundant Rail Safety

Toshiba Electronic Devices & Storage Corporation introduces a new high-side switch designed to improve power control reliability in automotive systems.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Ships Industry First 2nm Custom Compute SoC for AI

Broadcom launches its 3.5D XDSiP platform featuring 2nm technology and 3D-IC integration, enabling Fujitsu and other partners to scale high-performance, low-power XPUs for massive AI.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

TDK News

TDK at Embedded World 2026

From March 10 to 12 in Nuremberg, discover how TDK presents advanced sensors, power supplies, and motor controllers to drive efficiency in automotive, industrial, and smart technology sectors.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Advances HBF Standardization with Sandisk

A joint Open Compute Project workstream aims to define High Bandwidth Flash as a new scalable, power-efficient memory tier for AI inference infrastructure.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Anritsu News

AI acceleration technology for low-latency wireless communication

Anritsu and MediaTek have verified AI QoS and L4S technologies to optimize performance for latency-sensitive applications on 5G platforms.

Read more…

27 {{ "2026-02-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-27T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

High-Fidelity Emulation Advances AI-Native Networks

Keysight Technologies presents agentic AI, digital twins and network emulation at Mobile World Congress 2026 to validate 5G-Advanced, 6G and non-terrestrial network performance.

Read more…

Technical Articles

Satellite monitoring systems for real-time RF intelligence

Case studies

Früchte Jork puts new deep-freeze warehouse into operation

Integrated 600 V GaN Half-Bridge Simplifies Power Design

Infineon introduces compact driver-integrated power stage for motor drives and switched-mode supplies requiring efficient high-frequency conversion.

Embedded Platforms Align With Cyber Resilience Regulation

SYSGO will present virtualization-based real-time architectures at Embedded World 2026 to support certifiable safety and cybersecurity requirements in connected embedded systems.

75V Motor Driver ICs Target 48V Industrial Systems

STMicroelectronics introduces scalable motor-control chips supporting multiple motor types and up to 500 W applications across automation and electromechanical equipment.

Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology

Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs.

Compact Automotive Power Management IC Enhances Redundant Rail Safety

Toshiba Electronic Devices & Storage Corporation introduces a new high-side switch designed to improve power control reliability in automotive systems.

Broadcom Ships Industry First 2nm Custom Compute SoC for AI

Broadcom launches its 3.5D XDSiP platform featuring 2nm technology and 3D-IC integration, enabling Fujitsu and other partners to scale high-performance, low-power XPUs for massive AI.

TDK at Embedded World 2026

From March 10 to 12 in Nuremberg, discover how TDK presents advanced sensors, power supplies, and motor controllers to drive efficiency in automotive, industrial, and smart technology sectors.

SK hynix Advances HBF Standardization with Sandisk

A joint Open Compute Project workstream aims to define High Bandwidth Flash as a new scalable, power-efficient memory tier for AI inference infrastructure.

AI acceleration technology for low-latency wireless communication

Anritsu and MediaTek have verified AI QoS and L4S technologies to optimize performance for latency-sensitive applications on 5G platforms.

High-Fidelity Emulation Advances AI-Native Networks

Keysight Technologies presents agentic AI, digital twins and network emulation at Mobile World Congress 2026 to validate 5G-Advanced, 6G and non-terrestrial network performance.

International