13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

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Infimotion News

InfiMotion highlights advanced electric drives at Paris Motor Show

The supplier powers multiple automotive brands with integrated 800V and 900V high-efficiency traction systems.

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13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

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Infineon News

Digital Power-Path Protection for 800-Volt AI Server Architectures

Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.

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13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Link Layer Retry Validation in AI Ethernet Fabrics

Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.

Read more…

13 {{ "2026-10-13T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-13T00:00:00+00:00" | date "longDate" }}

Qualcomm News

AI-Native Broadband Network Innovation Platform

Qualcomm Technologies introduces Dragonwing platforms to transform fiber, Wi-Fi 8, and fixed wireless access infrastructure into edge-computed intelligent service environments.

Read more…

12 {{ "2026-10-12T00:00:00+00:00" | date "MMM" }} '26

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Fraunhofer News

Fraunhofer IPMS introduces miniaturized Li-Fi TinySpot optical transceiver

The ultra-low-power 5 mW data link provides secure, contactless 20 Mbps communication for space-constrained industrial sensors.

Read more…

12 {{ "2026-10-12T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-12T00:00:00+00:00" | date "longDate" }}

Hilscher News

Hilscher introduces comX 90CN for compact industrial devices

The connector-free embedded communication module gives OEMs flexible network interface placement and multiprotocol support.

Read more…

09 {{ "2026-10-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-09T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

Power and Edge Computing Semiconductors for Industrial Infrastructure

ROHM Semiconductor will present its analog and power architectures designed to support automotive electrification, industrial automation, and artificial intelligence data centers.

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09 {{ "2026-10-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-09T00:00:00+00:00" | date "longDate" }}

Kontron News

Global Electronics Manufacturing and IoT Supply Chain Integration

Kontron and Ennoconn are combining their regional production capabilities to provide original equipment manufacturers with a resilient digital supply chain for embedded systems.

Read more…

09 {{ "2026-10-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-09T00:00:00+00:00" | date "longDate" }}

Parker News

High-Airflow Electromagnetic Shielding for Data Centers

Parker Chomerics integrates stainless-steel honeycomb structures to provide component protection and optimal thermal regulation for power-dense telecommunications equipment.

Read more…

09 {{ "2026-10-09T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-09T00:00:00+00:00" | date "longDate" }}

Xaar News

Xaar at TechBlick 2026

From October 21-22 in Berlin, Germany, Xaar presents high-viscosity fluid-deposition architectures for scalable manufacturing of printed and production electronics.

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Market Overview

Quantum Electronics Moves Toward Commercialization

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

InfiMotion highlights advanced electric drives at Paris Motor Show

The supplier powers multiple automotive brands with integrated 800V and 900V high-efficiency traction systems.

Digital Power-Path Protection for 800-Volt AI Server Architectures

Infineon Technologies introduces a control system designed to manage high-voltage direct current connections and ensure operational stability within scalable data center infrastructure.

Link Layer Retry Validation in AI Ethernet Fabrics

Keysight demonstrates multi-vendor Link Layer Retry interoperability with Broadcom and Alibaba Cloud at the 2026 OCP Global Summit for AI scale-up networking.

AI-Native Broadband Network Innovation Platform

Qualcomm Technologies introduces Dragonwing platforms to transform fiber, Wi-Fi 8, and fixed wireless access infrastructure into edge-computed intelligent service environments.

Fraunhofer IPMS introduces miniaturized Li-Fi TinySpot optical transceiver

The ultra-low-power 5 mW data link provides secure, contactless 20 Mbps communication for space-constrained industrial sensors.

Hilscher introduces comX 90CN for compact industrial devices

The connector-free embedded communication module gives OEMs flexible network interface placement and multiprotocol support.

Power and Edge Computing Semiconductors for Industrial Infrastructure

ROHM Semiconductor will present its analog and power architectures designed to support automotive electrification, industrial automation, and artificial intelligence data centers.

Global Electronics Manufacturing and IoT Supply Chain Integration

Kontron and Ennoconn are combining their regional production capabilities to provide original equipment manufacturers with a resilient digital supply chain for embedded systems.

High-Airflow Electromagnetic Shielding for Data Centers

Parker Chomerics integrates stainless-steel honeycomb structures to provide component protection and optimal thermal regulation for power-dense telecommunications equipment.

Xaar at TechBlick 2026

From October 21-22 in Berlin, Germany, Xaar presents high-viscosity fluid-deposition architectures for scalable manufacturing of printed and production electronics.

International