Technical Articles

Satellite monitoring systems for real-time RF intelligence

Case studies

AI-Based Image Processing for Multi-Chamber Lamp Testing

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Keysight technologies News

GDDR7 Compliance Test Solution Accelerates High-Speed Memory Development

Keysight Technologies introduces a transmitter compliance solution designed to support PAM3-based GDDR7 validation for graphics and AI system developers.

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19 {{ "2026-02-19T00:00:00+00:00" | date "MMM" }} '26

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PEI-Genesis News

Smaller, smarter, greener connectors

How PEI-Genesis supports miniaturised, sustainable connector solutions across key industries.

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18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

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Sivers Semiconductors News

Ka-Band Beamforming ICs for Phased-Array SATCOM Terminals

Sivers Semiconductors targets seamless satellite handover and flat-antenna terminal design in multi-orbit broadband connectivity.

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18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

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Telit News

Telit Cinterion At MWC 2026

From March 2 to 5, in Barcelona, the company will demonstrate cutting-edge 5G RedCap, satellite connectivity, and AI-powered IoT modules to accelerate digital transformation and industrial connectivity across global markets.

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Toshiba News

Toshiba Introduces 6500V Press Pack IEGT

New 2000A trench-type IEGT supports high-voltage DC transmission, industrial drives and STATCOM systems with improved turn-off capability and compact converter design.

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18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

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TDK News

High-temperature NTC thermistors expand automotive sensing capabilities

TDK Corporation introduces new NTCSP thermistors designed for conductive-glue mounting and operation up to +175 °C, supporting high-temperature automotive power electronics and advanced sensing applications.

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18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

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Renesas News

Renesas Introduces 3nm TCAM for Automotive SoCs

Configurable 3nm FinFET TCAM achieves 5.27 Mb/mm² density, 0.167 fJ/bit search energy and enhanced functional safety for automotive and high-speed networking applications.

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17 {{ "2026-02-17T00:00:00+00:00" | date "MMM" }} '26

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Infineon News

Infineon supports zonal E/E architecture in Neue Klasse

Collaboration with BMW Group introduces centralized computing and software-defined vehicle functions for electrified platforms, integrating networking, control and power distribution layers.

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17 {{ "2026-02-17T00:00:00+00:00" | date "MMM" }} '26

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Fraunhofer News

Fraunhofer IPMS Introduces 10G TSN Endpoint IP Core

New IP Core enables deterministic Ethernet communication at up to 10 Gbit/s for automotive, industrial and safety-critical networks.

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17 {{ "2026-02-17T00:00:00+00:00" | date "MMM" }} '26

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Vision Components News

Vision Components Launches VC EvoCam with MediaTek Genio 510

Compact 65 × 40 mm board-level camera integrates Edge AI processing for embedded vision and will debut at embedded world 2026 in Nuremberg.

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