21
'25
Written on
Mouser News
20
'25
Written on
Delta Electronics
Delta Unveils Next-Generation DC Wallbox 50kW EV Charger with Advanced Features for Public Charging
Delta, a global leader in power management and a provider of IoT-based smart green solutions announced the launch of its next-generation DC Wallbox 50kW EV charger.
20
'25
Written on
TDK News
TDK launches automotive power-over-coax inductors for up to 1600 mA
TDK expands its ADL3225VF series of wire-wound inductors for automotive PoC, with mass production starting in March 2025.
20
'25
Written on
NXP News
NXP presents the FRDM i.MX 91 Development Board
Built around the i.MX 91 applications processor, this board is designed to accelerate industrial and IoT development, offering a cost-effective, secure and connectivity-rich platform.
20
'25
Written on
Texas Instruments News
TI presents new power management chips for modern data centers
The industry's first 48V integrated hot-swap eFuse with power-path protection streamlines data center design and enables designers to reach power levels beyond 6kW.
20
'25
Written on
Omron Components News
Omron's new high-temperature relay permits denser board designs
The G3VM S-VSON(L) MOS FET relay is capable of operating at ambient temperatures of up to 125˚C, improving on previous iterations which were limited to ambient temperatures of 110˚C.
19
'25
Written on
Mitsubishi Electric News
Mitsubishi Electric ships 16W GaN power amplifier for 3.6-4.0GHz 5G mMIMO
The 16W GaN power amplifier reduces costs and power consumption while enabling wider deployment of 5G mMIMO base stations.
19
'25
Written on
Kontron News
JUMPtec expands its strategic solution portfolio with Texas Instruments processors
JUMPtec announces a new SMARC module based on TI’s AM67A scalable edge AI processor, which integrates up to four Arm Cortex A53 CPU cores at 1.4-GHz, a 4 TOPS neural processing unit (NPU) and an extensive suite of on-device accelerators.
19
'25
Written on
Infineon News
Infineon unveils next generation of high-density power modules for vertical power delivery (VPD) in AI data centers
Infineon Technologies AG global semiconductor leader in power systems and IoT, launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute.
19
'25
Written on
Congatec News
