19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

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Micron News

Micron Innovates From the Data Center to the Edge With NVIDIA

Micron Technology leads memory innovation, becoming the first to ship both HBM3E and SOCAMM products, enhancing AI server performance in data centers with LPDDR solutions.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

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Renesas News

Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware

Advanced Power Management Solutions Include Fuel Gauge ICs, MCU, Pre-Validated Firmware, Software and Documentation to Drastically Simplify Battery Pack Design.

Read more…

19 {{ "2025-03-19T00:00:00+00:00" | date "MMM" }} '25

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ASMPT News

Critical Manufacturing MES Supports Plessey’s Experimental MicroLED Processes

Critical Manufacturing is pleased to announce that Plessey, renowned for its microLED display technology, has selected Critical Manufacturing MES to support its manufacturing workflows.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

Exxelia

Exxelia presents Only Pulse Capacitors with integrated bleed resistors

The Pulse CF/CFS series ensures high-energy density and high-rate of charge/discharge capability, making it the preferred choice for ignition applications of defense, space launch systems, and oil & gas applications.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

Kyocera News

KYOCERA AVX Unveils World’s First 47μF MLCC in 0402 Size

KYOCERA AVX’s 47µF MLCC in 0402 size supports AI servers, smartphones, and wearables by enabling miniaturization, high reliability, and efficient power management.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Enables Dynamic Test on a Wide-Bandgap Power Semiconductor Bare Chip

Easily and accurately measure dynamic characteristics on a Wide-Bandgap power semiconductor bare chip without soldering or probe needles.

Read more…

18 {{ "2025-03-18T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-18T00:00:00+00:00" | date "longDate" }}

BASLER News

Smart image processing in dynamic environments

Resistant to vibrations up to 5 g and shocks up to 50 g, the Basler Stereo visard camera reliably checks components and products for defects.

Read more…

17 {{ "2025-03-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-17T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

TI introduces the world's smallest MCU, enabling innovation in the tiniest of applications

TI introduces a groundbreaking MCU, 38% smaller than existing models, designed to enhance space efficiency, performance, and power optimization in compact electronics.

Read more…

17 {{ "2025-03-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-17T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron's new modular Ethernet switch module KSwitch M20

Modular, non-blocking and fully-managed 100Gb/s Ethernet switch module with Precision Time Protocol and extensive feature set.

Read more…

17 {{ "2025-03-17T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-03-17T00:00:00+00:00" | date "longDate" }}

AMD News

AMD launches 5th Gen EPYC processors for networking, storage, edge markets

High-performance “Zen 5” architecture offers server-grade performance and efficiency combined with purpose-built features for optimized product longevity and system resiliency.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

Micron Innovates From the Data Center to the Edge With NVIDIA

Micron Technology leads memory innovation, becoming the first to ship both HBM3E and SOCAMM products, enhancing AI server performance in data centers with LPDDR solutions.

Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware

Advanced Power Management Solutions Include Fuel Gauge ICs, MCU, Pre-Validated Firmware, Software and Documentation to Drastically Simplify Battery Pack Design.

Critical Manufacturing MES Supports Plessey’s Experimental MicroLED Processes

Critical Manufacturing is pleased to announce that Plessey, renowned for its microLED display technology, has selected Critical Manufacturing MES to support its manufacturing workflows.

Exxelia presents Only Pulse Capacitors with integrated bleed resistors

The Pulse CF/CFS series ensures high-energy density and high-rate of charge/discharge capability, making it the preferred choice for ignition applications of defense, space launch systems, and oil & gas applications.

KYOCERA AVX Unveils World’s First 47μF MLCC in 0402 Size

KYOCERA AVX’s 47µF MLCC in 0402 size supports AI servers, smartphones, and wearables by enabling miniaturization, high reliability, and efficient power management.

Keysight Enables Dynamic Test on a Wide-Bandgap Power Semiconductor Bare Chip

Easily and accurately measure dynamic characteristics on a Wide-Bandgap power semiconductor bare chip without soldering or probe needles.

Smart image processing in dynamic environments

Resistant to vibrations up to 5 g and shocks up to 50 g, the Basler Stereo visard camera reliably checks components and products for defects.

TI introduces the world's smallest MCU, enabling innovation in the tiniest of applications

TI introduces a groundbreaking MCU, 38% smaller than existing models, designed to enhance space efficiency, performance, and power optimization in compact electronics.

Kontron's new modular Ethernet switch module KSwitch M20

Modular, non-blocking and fully-managed 100Gb/s Ethernet switch module with Precision Time Protocol and extensive feature set.

AMD launches 5th Gen EPYC processors for networking, storage, edge markets

High-performance “Zen 5” architecture offers server-grade performance and efficiency combined with purpose-built features for optimized product longevity and system resiliency.

International