Now available from Powell Electronics, the Series 806 connector retains full MIL-DTL-38999 performance while reducing size and mass for aerospace and defense systems.
SOCAMM2 outperforms traditional RDIMM for AI servers, delivering over double the bandwidth and 55% less power consumption in a highly responsive, energy-efficient memory solution.
The updated AIEdge-X80 edge AI system increases inference performance to up to 157 TOPS using NVIDIA Jetson Orin platforms with Super Mode optimisation.
TDK expands its high-voltage switching portfolio with compact DC contactors designed to provide safety-relevant feedback in electric mobility and industrial energy systems.
SECO introduces an order-ready human–machine interface designed to shorten development cycles and support scalable edge computing across industrial and regulated environments.
Avnet ASIC and Bar-Ilan University are establishing a joint R&D hub to develop 2.5D and 3D chiplet integration based on advanced foundry nodes for European semiconductor applications.
Siemens EDA software is being deployed by Toshiba Electronic Devices & Storage Corporation to strengthen power device, analog, and mixed-signal semiconductor development.