Next-generation microcontrollers and sensors target real-time control, connectivity and perception across automotive, industrial automation and edge AI applications.

Collaboration with BMW Group introduces centralized computing and software-defined vehicle functions for electrified platforms, integrating networking, control and power distribution layers.

New opto-emulator devices simplify migration from optocouplers in high-voltage industrial and energy conversion systems.

Designed for USB Hi-Speed peripherals, the new controller adds security hardware, DMA support, and large on-chip buffering for data-intensive devices.

A new single-chip connectivity platform targets low-power IoT deployments by combining 20 MHz Wi-Fi 7, multi-protocol support, and robust operation in congested wireless environments.

Infineon Technologies and Flex introduce a modular development platform to accelerate zone-based E/E architectures for software-defined vehicles.

New 750 V G2 devices in Q-DPAK and D2PAK packages improve thermal behavior, switching efficiency, and gate-drive flexibility for automotive chargers and industrial power systems.

Infineon enables 3M to achieve reliable 10Gbps data transmission over extended passive cable lengths for industrial machine vision systems.

Infineon’s XDP hybrid-flyback controller and CoolGaN devices power Anker’s compact 160 W charger with enhanced efficiency, power density and system performance.

Combined HYPERRAM memory and controller IP enable high-bandwidth, low-power memory for MicroBlaze V RISC-V designs.