A new single-chip connectivity platform targets low-power IoT deployments by combining 20 MHz Wi-Fi 7, multi-protocol support, and robust operation in congested wireless environments.

Infineon Technologies and Flex introduce a modular development platform to accelerate zone-based E/E architectures for software-defined vehicles.

New 750 V G2 devices in Q-DPAK and D2PAK packages improve thermal behavior, switching efficiency, and gate-drive flexibility for automotive chargers and industrial power systems.

Infineon enables 3M to achieve reliable 10Gbps data transmission over extended passive cable lengths for industrial machine vision systems.

Infineon’s XDP hybrid-flyback controller and CoolGaN devices power Anker’s compact 160 W charger with enhanced efficiency, power density and system performance.

Combined HYPERRAM memory and controller IP enable high-bandwidth, low-power memory for MicroBlaze V RISC-V designs.

The lineup features PQC-ready TEGRION SLC27, advanced SECORA identity and payment platforms, plus biometric and sustainable solutions supported by FIDO authentication and live multi-trust demos.

New ASIL-D microcontroller adds intelligence to high-voltage BMS and supports zonal, software-defined vehicle architectures in partnership with Munich Electrification.

CoolGaN bi-directional switch enables single-stage power conversion, boosting energy output, reliability, and compactness while cutting power loss by up to 68%.

Infineon-led Mannheim-CeCaS unites 28 partners to develop modular, energy-efficient car server for autonomy advancement.