29 {{ "2024-10-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-29T00:00:00+00:00" | date "longDate" }}

ZEISS News

ZEISS Launches New Crossbeam 550 Samplefab FIB-SEM

ZEISS has announces the new ZEISS Crossbeam 550 Samplefab, a focused ion beam scanning electron microscope (FIB-SEM) optimized for fully automated preparation of transmission electron microscopy (TEM) samples (lamellae).

Read more…

28 {{ "2024-10-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-28T00:00:00+00:00" | date "longDate" }}

Vecow News

Vecow Expands High-Performance Edge AI Systems with Allxon OOB Management Capabilities

This collaboration equips Vecow's high-performance edge AI systems with remote management functionalities, levering Allxon's Out-of-Band (OOB) solutions to redefine efficiency and security across industries.

Read more…

28 {{ "2024-10-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-28T00:00:00+00:00" | date "longDate" }}

NXP News

NXP’s Advanced Trimension UWB Portfolio Hits the Road with Audi

The Trimension UWB Technology Powers Audi’s hands-free, secure car access for enhanced driver convenience, debuting with the Audi Q6 e-tron in 2024.

Read more…

28 {{ "2024-10-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-28T00:00:00+00:00" | date "longDate" }}

Navitas News

Navitas Previews Industry's First 8.5 kW AI Data Center Power Supply at electronica 2024

Explore the latest GaN and SiC technologies to ‘Electrify Our World’, & deliver the most efficient and reliable power solutions for AI data centers, EVs, and consumer markets, from 20 W to 20 MW.

Read more…

28 {{ "2024-10-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-28T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon addresses this challenge by introducing the CoolSiC Schottky diode 2000 V G5, the first discrete silicon carbide diode on the market with a breakdown voltage of 2000 V

CoolSiC Schottky diode 2000 V enables higher efficiency and design simplification in DC link systems up to 1500 VDC.

Read more…

26 {{ "2024-10-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-26T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Launches 900V Automotive Photorelay in Compact Package

New 900V Photorelay for 400V EV Battery Systems Enhances Safety, Enables Compact Design, and Lowers Costs.

Read more…

26 {{ "2024-10-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-26T00:00:00+00:00" | date "longDate" }}

Provertha News

PROVERTHA offers new SMT Slimline circular connectors in M12 format with standard footprint

Market-compatible SMT connectors with spring-elastic contacts for drop-in replacement at critical mechanical PCB interfaces.

Read more…

26 {{ "2024-10-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-26T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik now offers the F340 Y2 interference suppression film capacitors from Vishay

Certified in accordance with ENEC, CSA, CQC and UL for Safety and Humidity Robustness, the AEC-Q200-qualified Y2-class EMI suppression capacitors at 305 VAC rated voltage provide excellent performance in very harsh environments.

Read more…

25 {{ "2024-10-25T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-25T00:00:00+00:00" | date "longDate" }}

TDK News

TDK-Lambda to showcase latest advancements in power supply technology

The company will highlight the new GENESYS AC Series and Showcase Comprehensive Power Solutions for Industrial, Medical, and High-Power Applications at Electronica 2024.

Read more…

25 {{ "2024-10-25T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-10-25T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric News

Mitsubishi Electric Launches Infrared Sensor

The new MelDIR thermal-diode infrared sensor suppresses incident-light components that blur thermal images and uses a newly designed lens with double the field of view of existing sensors.

Read more…

ZEISS has announces the new ZEISS Crossbeam 550 Samplefab, a focused ion beam scanning electron microscope (FIB-SEM) optimized for fully automated preparation of transmission electron microscopy (TEM) samples (lamellae).

This collaboration equips Vecow's high-performance edge AI systems with remote management functionalities, levering Allxon's Out-of-Band (OOB) solutions to redefine efficiency and security across industries.

The Trimension UWB Technology Powers Audi’s hands-free, secure car access for enhanced driver convenience, debuting with the Audi Q6 e-tron in 2024.

Explore the latest GaN and SiC technologies to ‘Electrify Our World’, & deliver the most efficient and reliable power solutions for AI data centers, EVs, and consumer markets, from 20 W to 20 MW.

CoolSiC Schottky diode 2000 V enables higher efficiency and design simplification in DC link systems up to 1500 VDC.

New 900V Photorelay for 400V EV Battery Systems Enhances Safety, Enables Compact Design, and Lowers Costs.

Market-compatible SMT connectors with spring-elastic contacts for drop-in replacement at critical mechanical PCB interfaces.

Certified in accordance with ENEC, CSA, CQC and UL for Safety and Humidity Robustness, the AEC-Q200-qualified Y2-class EMI suppression capacitors at 305 VAC rated voltage provide excellent performance in very harsh environments.

The company will highlight the new GENESYS AC Series and Showcase Comprehensive Power Solutions for Industrial, Medical, and High-Power Applications at Electronica 2024.

The new MelDIR thermal-diode infrared sensor suppresses incident-light components that blur thermal images and uses a newly designed lens with double the field of view of existing sensors.

International