Renesas and Altium unveil Renesas 365, a groundbreaking solution integrating silicon, software, and lifecycle management, with live demonstrations at embedded world 2025, March 11-13, in Nuremberg, Germany.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a significant milestone in automotive cybersecurity. The company received ISO/SAE 21434 certification for its AURIX™ TC4Dx microcontroller.
Self-driving cars, 6G, and quantum communications strain fiber networks. Fraunhofer boosts capacity using LCoS optical switches to shrink data packets and distribute signals across fibers.
New Enhanced Fixed Wireless Access Solution Enables Communications Service Providers to Deliver AI-Optimized Performance, Seamless Availability, and Integrated Security.
The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.
Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.
Tria Technologies, an Avnet company specializing in embedded computing boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon® platforms at its Embedded World debut.