TDK Corporation further extends its InvenSense SmartAutomotive™ MEMS sensor family with the IAM-20685HP and IAM-20689 second generation 6-axis IMUs for automotive safety applications.
The industry’s first E3.S 60TB SSD, the Micron ION 6550 delivers best-in-class energy efficiency at up to 67% more density per rack for exascale data centers.
Anritsu Corporation has joined the OpenROADM Multi-Source Agreement (MSA), which defines specifications that facilitate multi-vendor interoperability for optical transmission networks.
NeoCortec's NeoMesh wireless network, combined with LoRa modulation, offers scalable, low-power wireless connectivity for smart buildings, with the Embit EMB-LR1280S module debuting at Electronica 2024.
STMicroelectronics has extended the STSPIN32 series of integrated motor drivers, adding eight new products to tackle cost-sensitive yet performance-hungry applications including power tools, home appliances and industrial automation.