Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, has received a new order, worth 955 kUSD (approximately 10 MSEK*) from the first established US Fortune 100 customer.
STMicroelectronics has released two STPOWER modules that contain 1200V silicon-carbide (SiC) MOSFETs in popular configurations. Each uses ST’s ACEPACK1 2 package technology to ensure high power density and simplified assembly.
As artificial intelligence (AI) technology is integrated into massive data centers, the demand for higher performance will continue to increase. Following this trend, high power density and energy-efficient solutions for smart enterprise systems have also become challenging.
Anritsu A/S is pleased to announce its latest partnership, working with SecuPi to deliver data protection and GDPR compliance to customers worldwide. A leading Tier-1 telecommunications provider, with some of the most stringent data protection requirements of any operator globally, is the first to benefit from this new partnership.
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, has signed a memorandum of understanding (MoU) with IBM, one of the leading global hybrid cloud, artificial intelligence (AI) and business services provider, to pursue accelerating open radio access network (RAN) deployments in Europe.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is now stocking the new Summit SOM 8M Plus Development Kit from Laird Connectivity.
Anritsu is attending the European Microwave Exhibition, the largest trade show dedicated to Microwaves and RF in Europe, showing its most advanced testing solutions for signal generation and signal analysis.
Facilitating the Integration of AI Computing. DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel® Ice Lake platform, powered by the 3rd Generation Intel® Xeon® Scalable processors, and equipped with ultra-high speed computing that can support up to 205W.