At MWC 2023, MediaTek will spotlight technology and product highlights from its Dimensity, Filogic, Genio, Kompanio, and Pentonic portfolios, along with a variety of new demos for 5G beyond mobile.
To be shown live at the Mobile World Congress Barcelona (Hall 5 Stand D41), the demonstration will combine a 5G communications environment developed by Anritsu with an immersive metaverse user experience provided by InterDigital.
The design will allow DOCOMO to switch between DOCOMO's on-premises NFV and AWS infrastructure for 5GC redundancy operations, offering a more flexible and cost-effective means to manage network performance and capacity.
The new ST87M01 series of ultra-compact and low-power modules combine highly reliable and robust NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets.
Sivers Semiconductors is proud to announce a collaboration with Intel and WiSig Network to launch the world's first 5G millimeter-wave FR2 stand-alone CPE solution.
Ambarella's new CV3-AD685 System-on-Chip advances Autonomous and Advanced Driver Assistance System (ADAS) applications, providing a single-chip solution for multi-sensor fusion and path planning.
These DIN rail terminal blocks are available in single-level or dual-level packages with 2, 3, or 4 position options, making them ideal for a range of DIN rail mount applications.
Infineon Technologies AG today announced it has added five new platform and module partners to support its proven high performance AIROC CYW5459x Wi-Fi and Bluetooth® combo portfolio.