Samsung News

Samsung Electronics Co., Ltd., established in 1969 and headquartered in Suwon, South Korea, is a global leader in consumer electronics, information technology, and mobile communications. The company offers a diverse portfolio of products and services, including smartphones, televisions, home appliances, semiconductors, and display panels, serving both consumer and enterprise markets. Samsung is committed to innovation, investing heavily in research and development to drive advancements in artificial intelligence, 5G, and IoT technologies. With a global presence spanning over 80 countries, Samsung continues to influence various industries through its cutting-edge technologies and solutions.

semiconductor.samsung.com

17 SEP '26

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Samsung Launches 245.76TB BM1773 SSD for High-Density AI Data Centers

E3.S QLC SSD combines PCIe 5.0, 4.5GB/s sequential writes, 50K IOPS and enhanced durability for demanding AI workloads.

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11 SEP '26

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Co-Optimized Semiconductor Design Platform for Advanced Node Artificial Intelligence

Cadence Design Systems & Samsung Foundry have expanded their technical partnership to provide certified design flows for 2-nanometer gate-all-around fabrication.

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10 AUG '26

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Next-Generation 3D Memory Architectures for AI Data Infrastructure

Samsung Electronics unveils advanced 3D memory technologies, focusing on stacking architectures to optimize bandwidth and capacity for artificial intelligence systems.

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06 AUG '26

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Next-Generation Vertically Stacked Memory Architectures For Artificial Intelligence Infrastructure

Samsung Electronics introduces advanced hybrid bonding technologies and ultra-high-layer storage components to maximize bandwidth efficiency in parallel computing systems.

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03 JUL '26

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Samsung Unveils HBM4E and Integrated AI Memory Infrastructure

Samsung Electronics has introduced its HBM4E memory architecture and Heat Path Block cooling technology at the COMPUTEX 2026 trade show.

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24 JUN '26

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Samsung Introduces Fastest UFS 5.0 Storage for Next-Generation Mobile AI

New memory solution delivers higher speeds, improved efficiency, and compact designs for smartphones, wearables, and XR devices.

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22 JUN '26

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Vertical Transistor Integration Through Stacked Nanosheet Architecture

Samsung Electronics advances semiconductor scaling by vertically integrating transistors to maximize spatial efficiency for next-generation logic devices.

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01 JUN '26

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HBM4E memory samples target next-generation AI infrastructure

Samsung Electronics begins shipment of 12-layer HBM4E samples with higher bandwidth, improved energy efficiency and expanded memory capacity for AI computing platforms.

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18 MAR '26

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Samsung Advances AI Memory With HBM4E & LPDDR6

These new high-bandwidth memory and low-power DRAM solutions target scalable AI infrastructures, edge computing, and data centers.

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12 MAR '26

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Multi-Die Design Frameworks for Advanced Semiconductor Systems

Samsung Foundry and Synopsys collaborate to develop integrated design flows enabling multi-die semiconductor architectures for AI, HPC, and advanced computing applications.

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