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Sivers Semiconductors News
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Infineon News
Infineon introduces highly-integrated MOTIX motor controller and 3-phase gate driver
Due to their numerous advantages, three-phase brushless DC (BLDC) motors are becoming the preferred choice for designing modern battery-powered motor products.
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CML Microcircuits News
CML announce the launch of the CMX90A702 5G Medium Power Amp
Operating at 28 GHz, the device is ideally suited to 5G mmWave infrastructure applications, including repeaters, small cells and backhaul solutions.
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Pickering News
Pickering Interfaces augments PXI microwave MUX with the addition of 67 GHz terminated switches to support 5G and semiconductor test
4x-785C PXI & PXIe range increases performance, minimizes space and cost Debuting at International Microwave Symposium (IMS), Booth 11006, Colorado Convention Center 19-24 June 2022, Denver.
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Congatec News
CONGATEC AND S.I.E LAUNCH CO-CREATION SERVICES FOR THE DIGITIZATION OF HEALTHCARE
At embedded world 2022, Congatec – a leading vendor of embedded and edge computing technology – and System Industrie Electronic – an ISO 13485 certified expert in system design and integration, mass production and assembly of medical OEM platforms – have officially launched their new co-creation services for the design of IT/ OT systems dedicated for the medical and healthcare sector.
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Diodes Incorporated News
Latest ReDriver, switch, clock buffer and clock generator devices announced at PCI-SIG Developers Conference
Diodes Incorporated Unveils Comprehensive PCIe 5.0 Portfolio That Will Increase Trace Lengths, Minimize Losses, and Improve Jitter Performance.
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Nexperia News
NEW LEVEL TRANSLATORS FROM NEXPERIA SUPPORT LEGACY AND FUTURE MOBILE PHONE SIM CARDS
Nexperia, the expert in essential semiconductors, today announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next generation low voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards.
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TDK News
WIRELESS POWER TRANSFER: TDK’S NEW DRAMATICALLY THINNER PATTERN COILS SET TO REVOLUTIONIZE WIRELESS CHARGING
TDK Corporation has introduced a thin pattern coil to support the wireless charging of next generation mobile devices. Industry-leading 0.76 ㎜ thickness achieved via unique pattern coil technology.
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NXP News
NXP EXTENDS S32 AUTOMOTIVE PLATFORM WITH S32Z AND S32E REAL-TIME PROCESSOR FAMILIES FOR NEW SOFTWARE-DEFINED VEHICLES
New class of processors with critical deterministic behavior of safe MCUs, but with unparalleled combination of gigahertz speed, multi-application isolation and memory expansion capabilities. Ideal for safe integration of cross-domain vehicle functions for software-defined vehicles.
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ONSEMI News
