07 {{ "2023-03-07T00:00:00+00:00" | date "MMM" }} '23

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Fraunhofer News

FRAUNHOFER PRESENTS NEW CONTROLLER IP CORE FOR SECURE DATA

The Fraunhofer Institute for Photonic Microsystems IPMS developed the MACsec Controller IP-Core, which implements the latest Ethernet security standards. It provides authentication, integrity and encryption of data between different nodes of a Local Area Network (LAN).

Read more…

07 {{ "2023-03-07T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon to acquire GaN Systems, strengthening its GaN portfolio and further reinforcing its global leadership in Power Systems

Infineon Technologies AG and GaN Systems Inc. (“GaN Systems”) today announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million.

Read more…

07 {{ "2023-03-07T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-07T00:00:00+00:00" | date "longDate" }}

Analog Devices News

Analog Devices and Marvell Showcase Next-Generation 5G Massive MIMO Radio Unit Platform at Mobile World Congress 2023

Collaboration combines industry-leading digital beamforming and transceiver silicon to propel advanced massive MIMO into mainstream.

Read more…

06 {{ "2023-03-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-06T00:00:00+00:00" | date "longDate" }}

Sensor-Test News

SENSOR+TEST 2023: Great international interest again

Just three months before the opening, preparations for SENSOR+TEST from May 09-11, 2023 are in full swing. The leading international trade fair for sensor, measuring and testing technology will again be held at the exhibition center in Nuremberg.

Read more…

06 {{ "2023-03-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-06T00:00:00+00:00" | date "longDate" }}

Nexperia News

NEXPERIA INTRODUCES IN-VEHICLE NETWORK ESD PROTECTION PORTFOLIO

A variety of packages, capacitance classes and 36 V VRWM provide design flexibility for commercial vehicle applications.

Read more…

06 {{ "2023-03-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-06T00:00:00+00:00" | date "longDate" }}

Renesas News

Tata Consultancy and Renesas Open Innovation Center for Semiconductors

Tata Consultancy Services announced the opening of a joint Innovation Center in Bengaluru and Hyderabad and to collaborate on radio frequency, digital and mixed-signal design and software development for innovative next generation semiconductor solutions.

Read more…

03 {{ "2023-03-03T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-03T00:00:00+00:00" | date "longDate" }}

TDK News

TDK: ALUMINIUM ELECTROLYTIC CAPACITORS FOR ON-BOARD CHARGERS

TDK's B43652 series of snap-in aluminium electrolytic capacitors for OBC applications are characterized by very compact dimensions and very high ripple current-carrying capacity.

Read more…

03 {{ "2023-03-03T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-03T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric News

MITSUBISHI ELECTRIC DEVELOPS 200GBPS EML CHIP

The 112Gbaud PAM4 EML chip will enable data centres to realize up to 800Gbps/1.6Tbps.

Read more…

02 {{ "2023-03-02T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-02T00:00:00+00:00" | date "longDate" }}

ST News

STMICROELECTRONICS EARNS USB-IF CERTIFICATION FOR COMPLETE USB PD EPR SOLUTION

ST is now able to deliver USB-IF-certified reference designs and chips to meet customers’ demands for a high-power, industry-standard universal charger/adapter.

Read more…

02 {{ "2023-03-02T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-02T00:00:00+00:00" | date "longDate" }}

TDK News

TDK: CALCULATING HOW MUCH CO₂ EMISSION IS REDUCED BY AN ELECTRONIC COMPONENT

TDK is helping to steer society toward higher energy efficiency by enumerating the contribution made by the components it manufactures to CO₂ emission reductions.

Read more…

Technical Articles

Satellite monitoring systems for real-time RF intelligence

FRAUNHOFER PRESENTS NEW CONTROLLER IP CORE FOR SECURE DATA

The Fraunhofer Institute for Photonic Microsystems IPMS developed the MACsec Controller IP-Core, which implements the latest Ethernet security standards. It provides authentication, integrity and encryption of data between different nodes of a Local Area Network (LAN).

Infineon to acquire GaN Systems, strengthening its GaN portfolio and further reinforcing its global leadership in Power Systems

Infineon Technologies AG and GaN Systems Inc. (“GaN Systems”) today announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million.

Analog Devices and Marvell Showcase Next-Generation 5G Massive MIMO Radio Unit Platform at Mobile World Congress 2023

Collaboration combines industry-leading digital beamforming and transceiver silicon to propel advanced massive MIMO into mainstream.

SENSOR+TEST 2023: Great international interest again

Just three months before the opening, preparations for SENSOR+TEST from May 09-11, 2023 are in full swing. The leading international trade fair for sensor, measuring and testing technology will again be held at the exhibition center in Nuremberg.

NEXPERIA INTRODUCES IN-VEHICLE NETWORK ESD PROTECTION PORTFOLIO

A variety of packages, capacitance classes and 36 V VRWM provide design flexibility for commercial vehicle applications.

Tata Consultancy and Renesas Open Innovation Center for Semiconductors

Tata Consultancy Services announced the opening of a joint Innovation Center in Bengaluru and Hyderabad and to collaborate on radio frequency, digital and mixed-signal design and software development for innovative next generation semiconductor solutions.

TDK: ALUMINIUM ELECTROLYTIC CAPACITORS FOR ON-BOARD CHARGERS

TDK's B43652 series of snap-in aluminium electrolytic capacitors for OBC applications are characterized by very compact dimensions and very high ripple current-carrying capacity.

MITSUBISHI ELECTRIC DEVELOPS 200GBPS EML CHIP

The 112Gbaud PAM4 EML chip will enable data centres to realize up to 800Gbps/1.6Tbps.

STMICROELECTRONICS EARNS USB-IF CERTIFICATION FOR COMPLETE USB PD EPR SOLUTION

ST is now able to deliver USB-IF-certified reference designs and chips to meet customers’ demands for a high-power, industry-standard universal charger/adapter.

TDK: CALCULATING HOW MUCH CO₂ EMISSION IS REDUCED BY AN ELECTRONIC COMPONENT

TDK is helping to steer society toward higher energy efficiency by enumerating the contribution made by the components it manufactures to CO₂ emission reductions.

International