Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced a collaboration with DEKRA, a leading global test house network, to ensure that chipset and device vendors can validate E112 caller location (universal European emergency number) functionality in compliance to a new European Union (EU) regulation.
Conta-Clip introduces the new, inverse and modular KDSI-SR cable entry system for reliable sealing, maximum flexibility and time savings feed-through for cables with and without plugs.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a new distribution agreement with Innodisk, a premier provider of industrial embedded flash and DRAM storage products and technologies, with a focus on the enterprise, industrial, medical, and aerospace industries.
Expanding on its history of delivering highly integrated processors, Texas Instruments (TI) today introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.
The iVativ RENO module is based on the Nordic nRF52840 SoC and supports Bluetooth 5.0, Thread/ZigBee/ANT and NFC-A is now available at Rutronik. It is suitable for smart home applications, asset trackers and location devices, smart fitness devices, healthcare systems, IIoT sensors and control, and mobile payments.
Helping to improve the reliability and safety of semiconductor devices in the IoT and automotive fields. Hitachi High-Tech Corporation has announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI2800, a critical component in any semiconductor manufacturer's metrology capabilities.
In its current study, "Germany's Innovation Leaders 2022", the F.A.Z.-Institut – a subsidiary of the Frankfurter Allgemeine Zeitung – once again counts the Munich-based semiconductor company among the leading innovation drivers.
Rutronik Elektronische Bauelemente GmbH and Solidigm, a global provider of NAND flash and SSD products, have signed a worldwide distribution agreement. The agreement covers Solidigm's entire product portfolio and is already effective.
Paper at ECTC Presents Success With Self-Assembly Process That Uses Capillary Forces Of Water to Align Dies on Target Devices for Possible Memory, HPC and Photonic Applications.