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Power Module Boosts AI Data Center Efficiency
Infineon Technologies introduces TLVR-based quad-phase power module to deliver high current density and efficient power delivery for next-generation AI processors.
www.infineon.com
As the industry’s first TLVR quad‑phase module in this compact form factor, the Infineon TDM24745T power module offers up to 320 A peak current capability.
Infineon Technologies has launched the TDM24745T, a quad-phase power module featuring trans-inductor voltage regulator (TLVR) technology, designed to meet the increasing power demands of AI data centers.
Context: Rising power demands in AI computing
AI workloads are driving rapid increases in power consumption within data centers. Advanced GPUs and AI accelerators require highly efficient, high-current power delivery systems that can operate within compact form factors.
As compute density increases, power architectures must deliver faster transient response, higher efficiency, and improved thermal performance while minimising space usage.
Technology: TLVR-enabled quad-phase design
The TDM24745T integrates four power stages, TLVR inductors, and decoupling capacitors into a compact module measuring 9 × 10 × 5 mm³.
TLVR technology enhances transient response and reduces the need for output capacitance by up to 50%, enabling more efficient and compact system designs. This approach supports stable power delivery to high-performance processors under dynamic workloads.
Performance: High current density and efficiency
The module achieves a current density exceeding 2 A/mm² and supports peak currents of up to 320 A. This makes it suitable for powering high-current core rails in AI processors and multiprocessor systems.
Built on OptiMOS™ technology, the module delivers improved efficiency and thermal performance, supporting operation in high-density server environments.
System integration: Scalable power architectures
The TDM24745T is designed to work with digital multiphase controllers, enabling flexible and scalable power architectures for AI server platforms.
By increasing power density and reducing component count, the module helps free up PCB space for additional compute resources, contributing to higher overall system performance.
Ecosystem: End-to-end power delivery solutions
The module forms part of Infineon’s broader power delivery ecosystem, which includes silicon, silicon carbide (SiC), and gallium nitride (GaN) technologies. This integrated approach supports efficient power conversion from grid input to processor-level supply.
Conclusion: Enabling next-generation AI infrastructure
With its combination of high current density, compact design, and advanced voltage regulation, the TDM24745T addresses key challenges in AI data center power delivery. The solution supports more efficient, scalable, and high-performance computing infrastructure as AI workloads continue to grow.
Edited by an industrial journalist, Lekshman Ramdas, with AI assistance.
www.infineon.com
Infineon Technologies has launched the TDM24745T, a quad-phase power module featuring trans-inductor voltage regulator (TLVR) technology, designed to meet the increasing power demands of AI data centers.
Context: Rising power demands in AI computing
AI workloads are driving rapid increases in power consumption within data centers. Advanced GPUs and AI accelerators require highly efficient, high-current power delivery systems that can operate within compact form factors.
As compute density increases, power architectures must deliver faster transient response, higher efficiency, and improved thermal performance while minimising space usage.
Technology: TLVR-enabled quad-phase design
The TDM24745T integrates four power stages, TLVR inductors, and decoupling capacitors into a compact module measuring 9 × 10 × 5 mm³.
TLVR technology enhances transient response and reduces the need for output capacitance by up to 50%, enabling more efficient and compact system designs. This approach supports stable power delivery to high-performance processors under dynamic workloads.
Performance: High current density and efficiency
The module achieves a current density exceeding 2 A/mm² and supports peak currents of up to 320 A. This makes it suitable for powering high-current core rails in AI processors and multiprocessor systems.
Built on OptiMOS™ technology, the module delivers improved efficiency and thermal performance, supporting operation in high-density server environments.
System integration: Scalable power architectures
The TDM24745T is designed to work with digital multiphase controllers, enabling flexible and scalable power architectures for AI server platforms.
By increasing power density and reducing component count, the module helps free up PCB space for additional compute resources, contributing to higher overall system performance.
Ecosystem: End-to-end power delivery solutions
The module forms part of Infineon’s broader power delivery ecosystem, which includes silicon, silicon carbide (SiC), and gallium nitride (GaN) technologies. This integrated approach supports efficient power conversion from grid input to processor-level supply.
Conclusion: Enabling next-generation AI infrastructure
With its combination of high current density, compact design, and advanced voltage regulation, the TDM24745T addresses key challenges in AI data center power delivery. The solution supports more efficient, scalable, and high-performance computing infrastructure as AI workloads continue to grow.
Edited by an industrial journalist, Lekshman Ramdas, with AI assistance.
www.infineon.com
