13 {{ "2025-02-13T00:00:00+00:00" | date "MMM" }} '25

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Infineon News

New industrial CoolSiC MOSFETs 650 V G2 in Q-DPAK and TOLL packages offer improved power density

To support this trend and further drive innovation at the system level, Infineon Technologies AG is expanding its portfolio of discrete CoolSiC™ MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.

Read more…

13 {{ "2025-02-13T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-13T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba launches H-bridge drivers for DC motors, enhancing efficiency & performance

The two H-bridge drivers for brushed DC motors, feature 50V & 3.5A output, real-time current monitoring, enhanced efficiency, precise control, and broader application possibilities.

Read more…

12 {{ "2025-02-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-12T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization

Achieves equivalent rated power in a smaller size with guaranteed stable long-term supply.

Read more…

12 {{ "2025-02-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-12T00:00:00+00:00" | date "longDate" }}

Delta Electronics

Delta to Showcase Cutting-Edge Energy Storage Solutions at Energy Storage Summit 2025

Delta, a global leader in power management and IoT-based smart green solutions, will unveil its latest energy storage innovations at Energy Storage Summit 2025, a leading European event for the energy storage industry.

Read more…

12 {{ "2025-02-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-12T00:00:00+00:00" | date "longDate" }}

Qualcomm News

Qualcomm and Saudi Arabia are pushing the boundaries of AI and 5G innovation

Saudi Arabia’s LEAP Conference highlights Qualcomm’s role in helping the Kingdom embrace the intelligent industry and hybrid AI future.

Read more…

12 {{ "2025-02-12T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-12T00:00:00+00:00" | date "longDate" }}

OMRON News

Omron expands sealed ultra subminiature switch range

The D2EW switch range has been engineered to increase flexibility in design for equipment designers and builders.

Read more…

10 {{ "2025-02-10T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-10T00:00:00+00:00" | date "longDate" }}

Exxelia

Exxelia tailored to meet the stringent demands of RF, military and aerospace applications

Leading the Way in Exxelia High-Performance Mica Capacitors for Critical Applications.

Read more…

07 {{ "2025-02-07T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-07T00:00:00+00:00" | date "longDate" }}

Rutronik News

Rutronik Adds High-Speed Isolated Gate Driver for GaN Transistors from ROHM

Rutronik introduces ROHM's BM6GD11BFJ-LB, a high-speed gate driver with integrated insulation, suitable for industrial applications controlling GaN HEMT transistors, offering 2,500 VRMS isolation voltage.

Read more…

07 {{ "2025-02-07T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-07T00:00:00+00:00" | date "longDate" }}

Cliff uk News

Cliff Electronics Introduces Dual USB2.0 & USB3.0 FeedThrough Connectors for Data & Power

These connectors are very versatile and suitable for a variety of applications, including automotive connectivity, consumer electronics, smart home devices, medical equipment, audio systems, charging stations, and power banks.

Read more…

07 {{ "2025-02-07T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-02-07T00:00:00+00:00" | date "longDate" }}

Panasonic Industry News

New Bluetooth module offers great performance while minimizing current consumption

The PAN B511-1x is Panasonic's next-gen Bluetooth 5.4 Module with a hybrid Castellated holes & LGA footprint design intended for cost-effective, high-performance Bluetooth Low Energy applications.

Read more…

White Paper

Maximize Your Power System Efficiency — Download Our Whitepaper!

New industrial CoolSiC MOSFETs 650 V G2 in Q-DPAK and TOLL packages offer improved power density

To support this trend and further drive innovation at the system level, Infineon Technologies AG is expanding its portfolio of discrete CoolSiC™ MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.

Toshiba launches H-bridge drivers for DC motors, enhancing efficiency & performance

The two H-bridge drivers for brushed DC motors, feature 50V & 3.5A output, real-time current monitoring, enhanced efficiency, precise control, and broader application possibilities.

ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization

Achieves equivalent rated power in a smaller size with guaranteed stable long-term supply.

Delta to Showcase Cutting-Edge Energy Storage Solutions at Energy Storage Summit 2025

Delta, a global leader in power management and IoT-based smart green solutions, will unveil its latest energy storage innovations at Energy Storage Summit 2025, a leading European event for the energy storage industry.

Qualcomm and Saudi Arabia are pushing the boundaries of AI and 5G innovation

Saudi Arabia’s LEAP Conference highlights Qualcomm’s role in helping the Kingdom embrace the intelligent industry and hybrid AI future.

Omron expands sealed ultra subminiature switch range

The D2EW switch range has been engineered to increase flexibility in design for equipment designers and builders.

Exxelia tailored to meet the stringent demands of RF, military and aerospace applications

Leading the Way in Exxelia High-Performance Mica Capacitors for Critical Applications.

Rutronik Adds High-Speed Isolated Gate Driver for GaN Transistors from ROHM

Rutronik introduces ROHM's BM6GD11BFJ-LB, a high-speed gate driver with integrated insulation, suitable for industrial applications controlling GaN HEMT transistors, offering 2,500 VRMS isolation voltage.

Cliff Electronics Introduces Dual USB2.0 & USB3.0 FeedThrough Connectors for Data & Power

These connectors are very versatile and suitable for a variety of applications, including automotive connectivity, consumer electronics, smart home devices, medical equipment, audio systems, charging stations, and power banks.

New Bluetooth module offers great performance while minimizing current consumption

The PAN B511-1x is Panasonic's next-gen Bluetooth 5.4 Module with a hybrid Castellated holes & LGA footprint design intended for cost-effective, high-performance Bluetooth Low Energy applications.

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