Keysight, FormFactor, DMPI and VDI have jointly developed this new VNA solution to provide on-wafer millimeter-wave component characterization under various conditions. Enables customers to shorten design and verification cycles for 5G and emerging 6G applications.
Power Integrations, the leader in high-voltage integrated circuits (ICs) for energy-efficient power conversion, today announced an expanded offering of the InnoSwitch4-CZ family of high-frequency, zero-voltage switching (ZVS) flyback controller ICs. When paired with Power Integrations' ClampZero active-clamp IC and, optionally, the recently announced HiperPFS-5 GaN-based power-factor corrector, the new ICs easily address the latest USB PD 3.1 specification for adapters and chargers up to 220 W.
NEC Corporation has deployed an AI-based traffic monitoring system to Central Nippon Expressway Company Limited (NEXCO CENTRAL). The system uses fiber-optic sensing and AI technologies to visualize traffic conditions, such as the location, speed, and direction of travel, from vibrations produced by vehicle movement.
Based on the 3GPP Rel. 15 standard, the FN980 is ideal for high-performance and bandwidth-intensive applications enabled by NVIDIA Jetson AGX Orin—the world’s most powerful, compact and energy-efficient AI supercomputer built for advanced robotics and autonomous machines, as well as edge computing.
Framework has announced that its newest generation Framework Laptops – powered by the latest 12th Gen Intel® Core P-series processors – are available for pre-order. Framework’s 2nd generation systems feature up to 12th Gen Intel Core i7-1280P processors.
TDK Corporation introduces PhaseCap® Energy Plus, two new series of EPCOS PFC capacitors. The B25674C* series is gas-impregnated and covers a voltage range from 230 V AC to 690 V AC and offers compensation ratings from 5 kvar to 33.1 kvar, depending on the type. The B25675C* series capacitors are impregnated with a biodegradable resin and are rated for voltages from 230 V AC to 1000 V AC, with compensation ratings of up to 60 kvar.
The LARA-L6 is a perfect fit for demanding size-constrained applications including video surveillance, dashcams, high-end telematics, gateways and routers, and connected health devices.
MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas.
The TEE501 sensing element offers excellent measurement accuracy of up to ±0.2 °C and is easy to integrate thanks to its small DFN enclosure. Austrian sensor manufacturer E+E Elektronik presents its first digital temperature sensing element in the form of the TEE501. It impresses with a measurement accuracy of up to ±0.2 °C and a wide temperature range. The small DFN enclosure with integrated pull-up resistors facilitates the design-in of the sensing element.