29
'22
Written on
Conrad News
29
'22
Written on
Anritsu News
Anritsu Introduces Software to Expand IQ Measurement and Analysis Capabilities of Field Spectrum Analysis Solutions
Comprehensive Suite of Tools Aids Government Regulators, Security Agencies, Spectrum Owners, and Defense Electronics Companies to Better Analyze RF Signals.
29
'22
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Mouser News
Mouser Electronics and Diotec Semiconductor Announce Global Distribution Agreement
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Diotec Semiconductor, designers and manufacturers of discrete semiconductor components.
29
'22
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ANSYS News
Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips
Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.
28
'22
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Congatec News
CONGATEC EXTENDS ITS 12TH GEN INTEL CORE PROCESSOR BASED COM-HPC
Congatec – a leading vendor of embedded and edge computing technology – introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each.
28
'22
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Accelleran News
VLAIO Funded Projects Enable Accelleran to Showcase Use of Open RAN Technology in uRLLC & Neutral Host Applications
Accelleran, a leading provider of Open RAN software solutions for 4G/5G networks, has confirmed that it is part of the winning consortia that are about to undertake two major projects.
28
'22
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CEVA News
CEVA Extends its RivieraWaves UWB IP to Support CCC's Digital Key 3.0 Standard for Keyless Access to Vehicles
CEVA, Inc, the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that its RivieraWaves ultra-wideband (UWB) IP has been extended with the RW-UWB-CCC MAC software package to support the Car Connectivity Consortium® (CCC) Digital Key 3.0 specification.
28
'22
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Toshiba News
TOSHIBA ANNOUNCES AVAILABILITY OF HIGHLY ACCURATE SPICE MODELS
Toshiba Electronics Europe GmbH (“Toshiba”) today announces the availability of highly accurate G2 SPICE models allowing designers to more faithfully simulate the performance of their designs before committing to hardware.
27
'22
Written on
ANSYS News
Ansys Multiphysics Solutions Achieve Certification for TSMC’s N3E and N4P Process Technologies
Ansys and TSMC extended their long-standing collaboration to achieve certification of Ansys’ power integrity software for TSMC’s industry-leading N4P and N3E process technologies. The certification for Ansys RedHawk-SC and Totem enables next generation silicon designs for machine learning, 5G mobile, and high-performance computing (HPC) applications. This latest collaboration builds on the recent certification of the Ansys platform for TSMC’s N4 and N3 processes.
27
'22
Written on
Digi-Key News
