06 {{ "2025-03-06T00:00:00+00:00" | date "MMM" }} '25

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Vector News

Vector Introduces Lightweight Embedded Software for Small ECUs Collaboration with Infineon Leads to New HAL Specification

Vector completes its modular platform for the development of Software-Defined Vehicles. The new Embedded Software product MICROSAR IO targets low-cost and resource-constrained microcontrollers.

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06 {{ "2025-03-06T00:00:00+00:00" | date "MMM" }} '25

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Provertha News

PROVERTHA launches new SMT Slimline circular connectors in M8 format with standard footprint

Market-compatible SMT connectors with spring-elastic contacts for drop-in replacement at critical mechanical PCB interfaces.

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06 {{ "2025-03-06T00:00:00+00:00" | date "MMM" }} '25

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Renesas News

Renesas 365 Revolutionizes Electronics Development with Unified Cloud-Based Platform

Renesas and Altium unveil Renesas 365, a groundbreaking solution integrating silicon, software, and lifecycle management, with live demonstrations at embedded world 2025, March 11-13, in Nuremberg, Germany.

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06 {{ "2025-03-06T00:00:00+00:00" | date "MMM" }} '25

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Infineon News

Infineon achieves ISO/SAE 21434 certification for AURIX™ TC4x and plans certification for TC3x family

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a significant milestone in automotive cybersecurity. The company received ISO/SAE 21434 certification for its AURIX™ TC4Dx microcontroller.

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06 {{ "2025-03-06T00:00:00+00:00" | date "MMM" }} '25

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Fraunhofer News

More Power for Fiber Optic Networks

Self-driving cars, 6G, and quantum communications strain fiber networks. Fraunhofer boosts capacity using LCoS optical switches to shrink data packets and distribute signals across fibers.

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06 {{ "2025-03-06T00:00:00+00:00" | date "MMM" }} '25

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Broadcom News

Broadcom Launches VeloSky to Deliver Network Convergence, Transform Connectivity

New Enhanced Fixed Wireless Access Solution Enables Communications Service Providers to Deliver AI-Optimized Performance, Seamless Availability, and Integrated Security.

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05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Intel News

Intel Xeon 6 to Prove Foundational to Network Infrastructure at MWC 2025

Intel Xeon 6 SoC enhances RAN capacity by 2.4x, AI performance by 3.2x, and efficiency by 70%, with broad 5G ecosystem adoption.

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05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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Telit News

Telit Cinterion Launches AI-Powered 5G Modules & Data Cards with Qualcomm’s Cutting-Edge Modem

The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.

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05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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TDK News

TDK adds full telemetry to new DC-DC converter modules for high power-density applications

The FS1606 offers 6A power, full telemetry via I²C, and a temperature range support between -40°C to 125°C in a compact 3.3 x 3.3 x 1.35 mm module.

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05 {{ "2025-03-05T00:00:00+00:00" | date "MMM" }} '25

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MIkroe News

MIKROE Unveils LTE IoT 10 Click Board for Global LTE-M and NB-IoT Solutions

Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.

Read more…

Vector completes its modular platform for the development of Software-Defined Vehicles. The new Embedded Software product MICROSAR IO targets low-cost and resource-constrained microcontrollers.

Market-compatible SMT connectors with spring-elastic contacts for drop-in replacement at critical mechanical PCB interfaces.

Renesas and Altium unveil Renesas 365, a groundbreaking solution integrating silicon, software, and lifecycle management, with live demonstrations at embedded world 2025, March 11-13, in Nuremberg, Germany.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a significant milestone in automotive cybersecurity. The company received ISO/SAE 21434 certification for its AURIX™ TC4Dx microcontroller.

Self-driving cars, 6G, and quantum communications strain fiber networks. Fraunhofer boosts capacity using LCoS optical switches to shrink data packets and distribute signals across fibers.

New Enhanced Fixed Wireless Access Solution Enables Communications Service Providers to Deliver AI-Optimized Performance, Seamless Availability, and Integrated Security.

Intel Xeon 6 SoC enhances RAN capacity by 2.4x, AI performance by 3.2x, and efficiency by 70%, with broad 5G ecosystem adoption.

The FE990D and FN990D, AI-powered 5G modules with Qualcomm X85/82, supports 3GPP Release 18 for FWA, networking, broadcasting, and satellite communication.

The FS1606 offers 6A power, full telemetry via I²C, and a temperature range support between -40°C to 125°C in a compact 3.3 x 3.3 x 1.35 mm module.

Powered by Sequans’ Monarch GM02S module, this dual-mode board supports smart cities, wearables, and industrial IoT with seamless, low-power connectivity.

International