Collaboration Advances DC Power Infrastructure

The increasing electricity demand from AI data centers and the modernization of electrical grids are driving the adoption of high-efficiency direct current (DC) power systems. Infineon Technologies AG and LS ELECTRIC have signed a Memorandum of Understanding (MoU) to jointly develop semiconductor-based DC power infrastructure for digital infrastructure, energy storage systems and future power networks.

Applications and Growing Demand for Direct Current Power Infrastructure
AI data centers, energy storage systems and next-generation electrical grids require power distribution systems capable of handling higher power densities while improving energy efficiency. As power networks become more distributed and electrically complex, DC architectures are being adopted to reduce conversion losses, support scalable infrastructure and improve overall system performance. The cooperation addresses these requirements through the development of advanced semiconductor-based power technologies for industrial and digital infrastructure.

Complementary Expertise and Division of Responsibilities
The collaboration combines Infineon Technologies AG's expertise in power semiconductors, microcontrollers and power control solutions with LS ELECTRIC's experience in power systems and industrial automation. Under the agreement, Infineon will supply the semiconductor technologies that form the foundation of the DC power infrastructure, while LS ELECTRIC will focus on system integration and implementation. The companies will also coordinate technology roadmaps and joint development activities to support future DC power platforms.

Semiconductor-Based Technologies for Power Conversion and Circuit Protection
The cooperation focuses on three key technologies: power conversion systems for energy storage systems, solid-state transformers (SSTs) and solid-state circuit breakers (SSCBs). Semiconductor-based SSTs can reduce transformer size and weight by up to 30 percent compared with conventional copper and iron-based designs while improving conversion efficiency. SSCBs use semiconductor switching devices and intelligent control algorithms to interrupt fault currents within microseconds, providing rapid protection against overloads and short circuits. Together, these technologies are designed to improve voltage conversion efficiency, system stability and operational reliability in high-density power environments.

Deployment Strategy and System Integration Approach
The jointly developed technologies are intended for deployment in AI data centers, energy storage installations and future DC power networks. Infineon will provide the semiconductor platform, while LS ELECTRIC will integrate these components into complete power infrastructure systems. The cooperation also includes coordinated engineering, product planning and technology development to support scalable implementation across industrial applications.

Expected Technical and Operational Impact
The collaboration supports the development of DC power infrastructure capable of addressing increasing electricity demand associated with AI computing and distributed energy systems. By combining semiconductor technologies with system integration expertise, the partners aim to improve energy efficiency, power conversion performance and infrastructure reliability while supporting the evolution of next-generation digital infrastructure.

"The increasing electricity demand, especially from AI data centers, is reshaping the way power is generated, distributed and consumed," said Andreas Weisl, Executive Vice President and Chief Sales Officer of Industrial & Infrastructure at Infineon.

"The importance of high-efficiency DC power technologies is growing more than ever with the expansion of AI data centers and next-generation power grids," said Kil Young Ahn, Vice President and Head of Production and R&BD at LS ELECTRIC.

Edited by Sucithra Mani, Induportals editor – adapted by AI.

www.infineon.com