Siemens’ Tessent IJTAG Pro enables parallel operations, reducing test time and costs for 2D, 2.5D, and 3D IC architectures.

Siemens’ Tessent AnalogTest reduces analog circuit test generation from months to days, achieving >95% defect coverage and 100x faster testing.

Excellicon’s timing constraint tools enhance SoC design by improving PPA, accelerating closure, and strengthening verification and implementation workflows.

Siemens’ AI-driven Questa One transforms IC verification into a self-optimizing system, accelerating cycles, reducing manual effort, and increasing productivity.

Siemens' first residual current circuit breaker uses UL-certified TECHNYL 4EARTH, featuring 50% recycled content, including chemically recycled PA6 from post-industrial & post-consumer sources.

Siemens announced a significant update to its industrial-grade private 5G infrastructure solution, that will enable manufacturers to cover larger industrial areas with enhanced connectivity capabilities.

Siemens and Foxconn sign a memorandum of understanding highlighting joint commitment to sustainability.

The integrated solutions provide customers with real-time visibility into global component availability, demand, cost and compliance data. Begins with integration of the Supplyframe DSI platform with Siemens’ Xpedition software for electronics systems design.

Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.

Siemens Digital Industries Software announced today availability of its leading Nucleus ReadyStart solution for embedded development targeting the fast-growing adoption of the RISC-V architecture.