The new TO-247PLUS-4 Reflow package enables higher DC-link voltages, improved thermal performance, and robust operation up to 200°C, optimizing power density in demanding industrial and e-mobility applications.

New CoolGaN Automotive family enhances efficiency, power density, and performance for next-generation electric and software-defined vehicles.

Infineon is collaborating with NVIDIA to drive the 800 VDC power architecture for AI data centers using SiC and GaN solutions, ensuring high efficiency, reliability, and serviceability to minimize downtime and carbon footprint.

New 48 V smart eFuses and 400 V/800 V hot-swap controller reference boards ensure fast overcurrent protection, real-time monitoring, and reliable, scalable power delivery for AI servers.

New dual-phase module delivers 140A output, 50% PDN loss reduction, ultra-fast transient response, and improved efficiency to meet AI growth demands.

New 25 V and 40 V devices deliver higher efficiency, reliability, and power density for switching and motor-drive applications in industrial and consumer markets.

UMEC's 250W PoE adapter leverages Infineon's CoolGaN transistors to achieve 95% efficiency and 39% higher power density, operating above 200 kHz for networking systems.

Infineon's OPTIGA Trust M security controller provides a hardware root-of-trust for Thistle's platform, enabling AES-256 model encryption and secure OTA updates for edge AI on Linux and MCU-based devices.

XHP 2 1700 V IGBT5 modules with .XT interconnect enhances efficiency, reliability, and service life, enabling Goldwind’s 4.5 MW turbines to stabilize grids and lower energy costs.

Infineon’s 12kW PSU reference design combines CoolSiC/CoolGaN technologies for 99% efficiency and 113 W/in³ density in AI data centers.