28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Bulgin News

Bulgin introduces innovative expanded beam fiber optic connector technology

Bulgin – a leading manufacturer of environmentally sealed connectors and components – has recently launched a patented* new expanded beam fiber optic connector and cable management system.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Launches dsPIC^® DSC-Based Integrated Motor Drivers

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Nexperia News

Nexperia broadens its range of discrete FET solutions at APEC 2024

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Power Integrations News

Power Integrations Launches InnoMux-2, a New Switcher IC Family With Multiple, Independently Regulated Outputs

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Qualcomm News

QUALCOMM PRESENTS GROUNDBREAKING INNOVATIONS AT MWC BARCELONA

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Mediatek News

MEDIATEK UNVEILS T300 5G REDCAP PLATFORM FOR IOT AND EXTREMELY LOW-POWER DEVICES

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

dSPACE News

DSPACE PRESENTS NEW MICROLABBOX II

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

Read more…

27 {{ "2024-02-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-27T00:00:00+00:00" | date "longDate" }}

Harman News

HARMAN Works With Qualcomm to Drive Automotive Innovation with New Ready Connect 5G TCU for Connected Cars

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

Read more…

27 {{ "2024-02-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-27T00:00:00+00:00" | date "longDate" }}

Wearin'

Wearin provides advancing Police Safety with IoT and AI-Enabled Tactical Vests

The innovative connected tactical vest project uses artificial intelligence (AI) for its abnormal-situation detection system and can transmit this warning to a command center via the Internet of Things (IoT).

Read more…

27 {{ "2024-02-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-27T00:00:00+00:00" | date "longDate" }}

Infineon News

INFINEON UNVEILS HIGH-DENSITY POWER MODULES FOR AI DATA CENTRES

Infineon TDM2254xD vertical power modules deliver best-in-class electrical and thermal efficiency with high power density and quality.

Read more…

White Paper

Delta Electronics: Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Bulgin introduces innovative expanded beam fiber optic connector technology

Bulgin – a leading manufacturer of environmentally sealed connectors and components – has recently launched a patented* new expanded beam fiber optic connector and cable management system.

Microchip Launches dsPIC^® DSC-Based Integrated Motor Drivers

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market.

Nexperia broadens its range of discrete FET solutions at APEC 2024

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

Power Integrations Launches InnoMux-2, a New Switcher IC Family With Multiple, Independently Regulated Outputs

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

QUALCOMM PRESENTS GROUNDBREAKING INNOVATIONS AT MWC BARCELONA

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

MEDIATEK UNVEILS T300 5G REDCAP PLATFORM FOR IOT AND EXTREMELY LOW-POWER DEVICES

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

DSPACE PRESENTS NEW MICROLABBOX II

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

HARMAN Works With Qualcomm to Drive Automotive Innovation with New Ready Connect 5G TCU for Connected Cars

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

Wearin provides advancing Police Safety with IoT and AI-Enabled Tactical Vests

The innovative connected tactical vest project uses artificial intelligence (AI) for its abnormal-situation detection system and can transmit this warning to a command center via the Internet of Things (IoT).

INFINEON UNVEILS HIGH-DENSITY POWER MODULES FOR AI DATA CENTRES

Infineon TDM2254xD vertical power modules deliver best-in-class electrical and thermal efficiency with high power density and quality.

International

White Paper

Bulgin – a leading manufacturer of environmentally sealed connectors and components – has recently launched a patented* new expanded beam fiber optic connector and cable management system.

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market.

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

The innovative connected tactical vest project uses artificial intelligence (AI) for its abnormal-situation detection system and can transmit this warning to a command center via the Internet of Things (IoT).

Infineon TDM2254xD vertical power modules deliver best-in-class electrical and thermal efficiency with high power density and quality.

International

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.