26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Semiconductors launches new 28 GHz 5G mmWave RF Module at Mobile World Congress 2024

Sivers Semiconductors AB has launched its new low-cost Radio Frequency Module BFM02803, covering 5G FR2 mmWave bands N257, N258, and N261 from 24.25 GHz to 29.5 GHz.

Read more…

26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Kontron News

Performance Uplift for High-End Edge Computing Platforms with the Latest Intel^® Xeon^® D-2800 and D-1800 Processors

Kontron introduces the COM-HPC^® Server Module COMh-sdID based on the Intel^® Xeon^® D-2800 processor, along with the COMh-sdIL and the COM-Express^® basic featuring the Intel^® Xeon^® D-1800 processor.

Read more…

26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Semiconductors showcasing the broadest mmWave portfolio on the market at Mobile World Congress 2024

Sivers Semiconductors will showcase its industry-leading mmWave portfolio of 5GmmWave, unlicensed 5G, and satellite communications products at Mobile World Congress (MWC) 2024 in Barcelona.

Read more…

26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology to Enable Real-Time Processing

Renesas Electronics Corporation has developed embedded processor technology that enhances the speed and power efficiency of microprocessor units (MPUs) for advanced vision AI.

Read more…

26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Samsung News

SAMSUNG ELECTRONICS COLLABORATES WITH ARM ON OPTIMIZED NEXT-GEN CORTEX-X CPU

The collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.

Read more…

26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Telit News

TELIT CINTERION TO TRANSFORM IOT CONNECTIVITY WITH 5G REDCAP INTEGRATION

The state-of-the-art 5G RedCap modules and devices sampled at MWC Barcelona will be available for commercial purchase during the second half of 2024.

Read more…

26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

KEYSIGHT VERIFIES AUTOTALKS’ 5G NEW RADIO VEHICLE-TO-EVERYTHING SYSTEM-ON-A-CHIP

The solution provided physical layer verification testing against 3GPP Release 16 Sidelink standards.

Read more…

23 {{ "2024-02-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-23T00:00:00+00:00" | date "longDate" }}

U Blox News

u-blox releases versatile Wi-Fi 6 module for the mass market

NORA-W4 is highly reliable, and the most cost-effective single-band Wi-Fi 6 module ideal for battery-operated devices.

Read more…

23 {{ "2024-02-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-23T00:00:00+00:00" | date "longDate" }}

Intel News

INTEL LAUNCHES WORLD’S FIRST SYSTEMS FOUNDRY DESIGNED FOR THE AI ERA

Intel announces expanded process roadmap, customers and ecosystem partners to deliver on its ambition to be the No. 2 foundry by 2030.

Read more…

22 {{ "2024-02-22T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-22T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

New Thermal Printhead Provides Clear Printing at High Speeds Even on a Single-Cell Li-ion Battery

Novel design contributes to greater miniaturization, lighter weight, and improved energy savings.

Read more…

White Paper

Delta Electronics: Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Sivers Semiconductors launches new 28 GHz 5G mmWave RF Module at Mobile World Congress 2024

Sivers Semiconductors AB has launched its new low-cost Radio Frequency Module BFM02803, covering 5G FR2 mmWave bands N257, N258, and N261 from 24.25 GHz to 29.5 GHz.

Performance Uplift for High-End Edge Computing Platforms with the Latest Intel^® Xeon^® D-2800 and D-1800 Processors

Kontron introduces the COM-HPC^® Server Module COMh-sdID based on the Intel^® Xeon^® D-2800 processor, along with the COMh-sdIL and the COM-Express^® basic featuring the Intel^® Xeon^® D-1800 processor.

Sivers Semiconductors showcasing the broadest mmWave portfolio on the market at Mobile World Congress 2024

Sivers Semiconductors will showcase its industry-leading mmWave portfolio of 5GmmWave, unlicensed 5G, and satellite communications products at Mobile World Congress (MWC) 2024 in Barcelona.

Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology to Enable Real-Time Processing

Renesas Electronics Corporation has developed embedded processor technology that enhances the speed and power efficiency of microprocessor units (MPUs) for advanced vision AI.

SAMSUNG ELECTRONICS COLLABORATES WITH ARM ON OPTIMIZED NEXT-GEN CORTEX-X CPU

The collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.

TELIT CINTERION TO TRANSFORM IOT CONNECTIVITY WITH 5G REDCAP INTEGRATION

The state-of-the-art 5G RedCap modules and devices sampled at MWC Barcelona will be available for commercial purchase during the second half of 2024.

KEYSIGHT VERIFIES AUTOTALKS’ 5G NEW RADIO VEHICLE-TO-EVERYTHING SYSTEM-ON-A-CHIP

The solution provided physical layer verification testing against 3GPP Release 16 Sidelink standards.

u-blox releases versatile Wi-Fi 6 module for the mass market

NORA-W4 is highly reliable, and the most cost-effective single-band Wi-Fi 6 module ideal for battery-operated devices.

INTEL LAUNCHES WORLD’S FIRST SYSTEMS FOUNDRY DESIGNED FOR THE AI ERA

Intel announces expanded process roadmap, customers and ecosystem partners to deliver on its ambition to be the No. 2 foundry by 2030.

New Thermal Printhead Provides Clear Printing at High Speeds Even on a Single-Cell Li-ion Battery

Novel design contributes to greater miniaturization, lighter weight, and improved energy savings.

International

White Paper

Sivers Semiconductors AB has launched its new low-cost Radio Frequency Module BFM02803, covering 5G FR2 mmWave bands N257, N258, and N261 from 24.25 GHz to 29.5 GHz.

Kontron introduces the COM-HPC® Server Module COMh-sdID based on the Intel® Xeon® D-2800 processor, along with the COMh-sdIL and the COM-Express® basic featuring the Intel® Xeon® D-1800 processor.

Sivers Semiconductors will showcase its industry-leading mmWave portfolio of 5GmmWave, unlicensed 5G, and satellite communications products at Mobile World Congress (MWC) 2024 in Barcelona.

Renesas Electronics Corporation has developed embedded processor technology that enhances the speed and power efficiency of microprocessor units (MPUs) for advanced vision AI.

The collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.

The state-of-the-art 5G RedCap modules and devices sampled at MWC Barcelona will be available for commercial purchase during the second half of 2024.

The solution provided physical layer verification testing against 3GPP Release 16 Sidelink standards.

NORA-W4 is highly reliable, and the most cost-effective single-band Wi-Fi 6 module ideal for battery-operated devices.

Intel announces expanded process roadmap, customers and ecosystem partners to deliver on its ambition to be the No. 2 foundry by 2030.

Novel design contributes to greater miniaturization, lighter weight, and improved energy savings.

International

Kontron introduces the COM-HPC^® Server Module COMh-sdID based on the Intel^® Xeon^® D-2800 processor, along with the COMh-sdIL and the COM-Express^® basic featuring the Intel^® Xeon^® D-1800 processor.