TI's exhibit in hall 3A, booth 131 will showcase the latest advancements in application areas such as robotics, energy transition and electric vehicles.
Vishay Intertechnology has announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV.
Infineon Technologies AG introduces the new CoolSiC™ MOSFETs 2000 V in the TO-247PLUS-4-HCC package to meet designers' demand for increased power density without compromising the system's reliability even under demanding high voltage and switching frequency conditions.