11 {{ "2019-12-11T00:00:00+00:00" | date "MMM" }} '19

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Autodesk News

New Electronics Capabilities Are Coming to Fusion 360

This year at Autodesk University, we’re celebrating the opportunity to design and make better products while using a better cloud-connected product development platform. In that spirit, we’re announcing a new electronics environment in Fusion 360 to further enhance our customers’ capacity to innovate.

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11 {{ "2019-12-11T00:00:00+00:00" | date "MMM" }} '19

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Advantech Embedded-IoT Group

Rugged Pico-ITX MIO-2361 SBC Featuring Onboard LPDDR4 & eMMC

Advantech (2395.TW), a leading global provider of intelligent IoT systems and embedded platforms, is pleased to announce MIO-2361, the latest Pico-ITX single board computer designed with onboard LPDDR4-2400 & 32G eMMC powered by Intel^® Atom™ E3900 series/Pentium^® N4200/Celeron^® N3350 processors.

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10 {{ "2019-12-10T00:00:00+00:00" | date "MMM" }} '19

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Ametek News

AMETEK VIS Launches New C-COM 10.1 Inch GX-100 Display

AMETEK Vehicular Instrumentation Systems (VIS), the industry leader in custom dashboard instrument displays for construction and military vehicles, is proud to introduce the latest in its C-COM product line: the 10GX-100 with a 10.1-inch touchscreen display.

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10 {{ "2019-12-10T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-12-10T00:00:00+00:00" | date "longDate" }}

MURATA News

The world’s first common mode choke coil for Automotive Ethernet that can withstand temperatures up to 150 degrees Celsius

Murata Manufacturing Co., Ltd. (Head Office: Nagaokakyo-shi, Kyoto; Chairman of the Board and President: Tsuneo Murata) today announced that the DLW32MH201YK2, a common mode choke coil (CMCC) for Automotive Ethernet1 (100BASE-T12). Withstanding extreme temperatures ranging from -55 to +150°C, makes this product a world first for its type*3.

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06 {{ "2019-12-06T00:00:00+00:00" | date "MMM" }} '19

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Ametek News

Creaform Launches HandySCAN AEROPACK for the Aerospace Industry

Creaform, a worldwide leader in portable and automated 3D measurement solutions, announced today the release of HandySCAN AEROPACK, a 3D scanning solution suite that addresses the specific challenges of aircraft quality control, such as assessing damage from hailstorms or aircraft incidents as well as flap and spoiler inspections.

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06 {{ "2019-12-06T00:00:00+00:00" | date "MMM" }} '19

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ST News

Complete USB Type-C Port-Protection IC from STMicroelectronics Simplifies Connectivity Upgrade for Mass-Market Devices

Designers can easily migrate small electronic devices from legacy USB^® Micro-A or Micro-B interconnects to the latest Type-C style with the STMicroelectronics TCPP01-M12 port protector, which satisfies all protection requirements for USB-C™ connections.

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05 {{ "2019-12-05T00:00:00+00:00" | date "MMM" }} '19

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Vishay News

Vishay Intertechnology 2 A to 12 A Synchronous Buck Regulators in Compact 5x5 PowerPAK^® Package Offer Peak Efficiencies of 98 %

Providing Wide Input Voltage Ranges From 4.5 V to 60 V, Versatile Devices Feature Internal Compensation to Reduce External Components.

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04 {{ "2019-12-04T00:00:00+00:00" | date "MMM" }} '19

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PEPPERL+FUCHS FACTORY AUTOMATION

IO-Link master with OPC UA

Seamless Communication from the Field Level to the Cloud

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04 {{ "2019-12-04T00:00:00+00:00" | date "MMM" }} '19

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ST News

STMicroelectronics Adds Support for LoRaWAN^® Firmware Update Over The Air in the STM32Cube Ecosystem

STMicroelectronics has enhanced its STM32* LoRaWAN^® software expansion package for developers (I-CUBE-LRWAN ) to support the latest Firmware Update Over The Air (FUOTA) specifications.

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04 {{ "2019-12-04T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-12-04T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Releases its First eFuse, an Electronic Fuse that can be Repeatedly Used

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCKE8xx series,” its first-ever eFuse ICs, a lineup of six products that support various functions needed for circuit protection in power supply lines. Shipments of two products in the lineup start today.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

New Electronics Capabilities Are Coming to Fusion 360

Rugged Pico-ITX MIO-2361 SBC Featuring Onboard LPDDR4 & eMMC

AMETEK VIS Launches New C-COM 10.1 Inch GX-100 Display

AMETEK Vehicular Instrumentation Systems (VIS), the industry leader in custom dashboard instrument displays for construction and military vehicles, is proud to introduce the latest in its C-COM product line: the 10GX-100 with a 10.1-inch touchscreen display.

The world’s first common mode choke coil for Automotive Ethernet that can withstand temperatures up to 150 degrees Celsius

Creaform Launches HandySCAN AEROPACK for the Aerospace Industry

Complete USB Type-C Port-Protection IC from STMicroelectronics Simplifies Connectivity Upgrade for Mass-Market Devices

Designers can easily migrate small electronic devices from legacy USB^® Micro-A or Micro-B interconnects to the latest Type-C style with the STMicroelectronics TCPP01-M12 port protector, which satisfies all protection requirements for USB-C™ connections.

Vishay Intertechnology 2 A to 12 A Synchronous Buck Regulators in Compact 5x5 PowerPAK^® Package Offer Peak Efficiencies of 98 %

Providing Wide Input Voltage Ranges From 4.5 V to 60 V, Versatile Devices Feature Internal Compensation to Reduce External Components.

IO-Link master with OPC UA

Seamless Communication from the Field Level to the Cloud

STMicroelectronics Adds Support for LoRaWAN^® Firmware Update Over The Air in the STM32Cube Ecosystem

STMicroelectronics has enhanced its STM32* LoRaWAN^® software expansion package for developers (I-CUBE-LRWAN ) to support the latest Firmware Update Over The Air (FUOTA) specifications.

Toshiba Releases its First eFuse, an Electronic Fuse that can be Repeatedly Used

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCKE8xx series,” its first-ever eFuse ICs, a lineup of six products that support various functions needed for circuit protection in power supply lines. Shipments of two products in the lineup start today.

International

Market Overview

Technical Articles

Case studies

AMETEK Vehicular Instrumentation Systems (VIS), the industry leader in custom dashboard instrument displays for construction and military vehicles, is proud to introduce the latest in its C-COM product line: the 10GX-100 with a 10.1-inch touchscreen display.

Designers can easily migrate small electronic devices from legacy USB® Micro-A or Micro-B interconnects to the latest Type-C style with the STMicroelectronics TCPP01-M12 port protector, which satisfies all protection requirements for USB-C™ connections.

Providing Wide Input Voltage Ranges From 4.5 V to 60 V, Versatile Devices Feature Internal Compensation to Reduce External Components.

Seamless Communication from the Field Level to the Cloud

STMicroelectronics has enhanced its STM32* LoRaWAN® software expansion package for developers (I-CUBE-LRWAN ) to support the latest Firmware Update Over The Air (FUOTA) specifications.

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCKE8xx series,” its first-ever eFuse ICs, a lineup of six products that support various functions needed for circuit protection in power supply lines. Shipments of two products in the lineup start today.

International

Designers can easily migrate small electronic devices from legacy USB^® Micro-A or Micro-B interconnects to the latest Type-C style with the STMicroelectronics TCPP01-M12 port protector, which satisfies all protection requirements for USB-C™ connections.

STMicroelectronics has enhanced its STM32* LoRaWAN^® software expansion package for developers (I-CUBE-LRWAN ) to support the latest Firmware Update Over The Air (FUOTA) specifications.