Anritsu Corporation is pleased to announce its enhanced partnership with Bluetest AB of Sweden offering a new unified test solution for Over The Air (OTA) measurement of 5G mobile terminals.
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the results of a three-way collaboration with TSMC and Microsoft focused on utilizing cloud infrastructure to reduce semiconductor design signoff schedules. Through this collaboration, common customers will have an accelerated path to complete timing signoff by adopting the Cadence® Tempus Timing Signoff Solution and the Quantus Extraction Solution using TSMC technologies on the Microsoft Azure Cloud with the Cadence CloudBurst Platform.
Only Axon’ Cable currently provides a range of RF cable assemblies up to 45 GHz which has been QPL qualified by ESA according to the ESCC3408/003 specification. Up to twice as light as non-approved equivalent products, these cable assemblies achieve excellent electrical characteristics.
RZ/V2M Kicks Off New MPU Series with Real-Time AI Inference and Low-Power Consumption for Cameras Used in Industrial, Infrastructure, and Retail Applications.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced that, for the second consecutive year, its flagship image recognition processor for driver assistance systems has contributed to the success of Toyota Motor Corporation (“Toyota”) vehicles in the Japan New Car Assessment Program (JNCAP).
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announces the availability of a compact and cost-effective reference design ideally suited for monitoring social distancing, assuring remote operation, provisioning, as well as warning, anti-tampering, and potentially providing contact tracing to protect human health in all environments, including in response to global or local pandemic conditions.
NXP Semiconductors N.V. announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform. This collaboration combines NXP’s automotive design expertise with TSMC’s industry-leading 5nm technology to further drive the transformation of automobiles into powerful computing systems for the road.