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'20
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CUI News
24
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Infineon News
QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers. Too often, different thermal coefficients lead to an expansion mismatch of different materials.
23
'20
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EMITECH
Emitech recognized as a Certification Body (CB) under the CB Scheme
Since 2014, Emitech has had its own international certification service called Emitech Certification. It has now been recognized as an NCB (National Certification Body).
23
'20
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Infineon News
Infineon goes digital – Chip manufacturer invites to a virtual tour of its trade shows
Trade shows are an essential part of communication with customers – this is where new technologies and innovative products are launched. As a result of the coronavirus, numerous trade fairs had to be cancelled or postponed since spring 2020. In the short term, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is therefore strengthening its own activities in the digitalization of sales and marketing activities. The semiconductor manufacturer is thus presenting two important trade show highlights on the internet in July: power semiconductors and sensors.
23
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inova Semiconductors News
Inova Semiconductors provides standalone ISELED LED driver & controller in volume production and AEC-Q100 qualified
In addition to its LED driver/controller die, integrated in smart ISELED LED modules, Inova Semiconductors offers the driver chip as a standalone solution. The standalone ISELED driver is now available in volume production and is AEC-Q100 qualified.
23
'20
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GCT News
Shielded USB Connections for Superior Sound
For many premium consumer electronic devices, adoption of the latest connectors is essential. These devices must perform at their very best and have very little in the way of compromise, providing the users with a product that justifies the associated price tag.
23
'20
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CEA Leti News
CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
In an FDSOI CMOS processing breakthrough, CEA-Leti scientists have pushed fabrication thermal-process boundaries down to 500°C for CMOS integration, while showing strong performance gains especially in P-type metal-oxide-semiconductor (PMOS) logic devices.
23
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SOURIAU – SUNBANK Connection Technologies
The SOURIAU 8STA series, a benchmark for high-performance connectors in the world of motorsport
Its compact size and low mass, coupled with its incredible robustness and resistance to shock and vibration have made SOURIAU's 8STA the connector of choice for racing teams at the highest level of the sport looking for the state-of-the-art to improve the electrical performance of their machines. These connectors are commonly used on steering boss systems, temperature and pressure sensors, data acquisition and electronic control systems and inside fuel tanks.
22
'20
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Intel News
Intel Announces Unmatched AI and Analytics Platform with New Processor, Memory, Storage and FPGA Solutions
Intel introduced its 3rd Gen Intel® Xeon® Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of artificial intelligence (AI) and analytics workloads running in data center, network and intelligent-edge environments.
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Stemmer imaging News
