With the takeover of the Scottish-French company TPL Vision, wenglor is once again reinforcing its position in the Machine Vision sector – specifically with innovative LED illumination technologies for industrial image processing. The specialist founded in 2005 will be integrated into the wenglor group as a division, but will continue to exist as an independent business unit.
Melexis, a global leader in automotive semiconductors, and emotion3D, a leading provider of camera-based automotive in-cabin analysis software, have joined forces to offer a unique 3D Time-of-Flight (ToF) demonstrator. The solution combines the driver monitoring system (DMS) with high-precision 3D driver localization, to dynamically align augmented reality head-up displays (AR HUD) objects.
Samsung and Cadence co-develop Mixed-Signal OpenAccess-ready PDKs that enable seamless implementation and verification of mixed-signal designs for data centers, networking, 5G, mobile, industrial and automotive applications.
Infineon Technologies AG today officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto “Ready for Mission Future.”
Sivers Semiconductors AB today announces that its Japanese lead customer Fujikura, after several successful customer trials, is now preparing the start of full-scale, high-quality volume production of their 60 GHz communication module.
Tektronix, Inc., a leading worldwide provider of test and measurement solutions, today released KTE V7.1 software for the Keithley S530 Series Parametric Test System to help accelerate semiconductor chip manufacturing just when the world market needs it most.