Targeting Internet of Things Sensing Networks, NevadaNano will show the Mini Flammable in booth #733 at Sensors Converge this week, September 21 through 23.
New development kit bundles all of the hardware, add-on open software and algorithms required to test, prototype, and debug voice and audio functionality and integration in new applications for smart home, consumer technology, industrial, and beyond.
In recent years the beverage cooler market has seen increasing demand for solutions that reduce environmental impact by cutting energy consumption and emissions, and that feature connectivity options to give beverage companies better intelligence on the sales performance and user habits of their merchandisers in the field.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has developed a model-based development (MBD) simulation technology that shortens verification times for automotive semiconductors by about 90 percent.
Industry-leading power density, new architectures and integration can reduce total cost of ownership, helping engineers solve enterprise-server design challenges.
Sivers Semiconductors AB today announced the launch of the new highly integrated, state-of-art 5G NR Radio Frequency Integrated Circuits (RFICs), TRB02801 and TRB03901, together with very high-powered RFIC and antenna RF modules, BFM02801 and BFM03901, covering all licensed 5G mmWave bands.
A fully integrated charger solution combines USB PD, PPS, PowiGaN and FluxLink to maximize efficiency and slash component count in adapters and chargers.