01
'21
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Vision Components News
01
'21
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CEVA News
CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds
Companies collaborate to bring complete 3D spatial audio hardware and software solution to consumer electronics OEMs and ODMs. CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, together Beken Corporation, a key player in wireless communication solutions, and VisiSonics, the technology leader in 3D spatial audio technologies, today announced the availability of a complete 3D audio reference design for the rapid deployment of headsets and True Wireless Stereo (TWS) earbuds supporting spatial audio for use in gaming, multimedia and conferencing.
01
'21
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Lane Electronics News
Wide Range of Positronic industry standard D-Sub high reliability connectors for Military, Aerospace and Industrial applications available from Lane Electronics
Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, is an authorised distributor for Positronic, a market leading manufacturer of high reliability signal and power connectors providing mission critical performance.
01
'21
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Binder News
Simplify safe signal transmission in sensor-actuator applications
Field-wireable M8 signal cable connectors from binder support efficient and reliable installations in sensor and actuator applications. Featuring snap-in quick locking and now offered with 3 to 6 pins, they prove themselves in industrial applications that require reliable signal transmission and are subject to installation space constraints.
01
'21
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Microsys News
MicroSys Partners with Leading AI Chipmaker Hailo to Launch High-Performance, Embedded AI Platform
MicroSys miriac embedded modules and platforms combined with Hailo-8 AI acceleration modules offer a high-performance, scalable embedded platform for AI processing at the edge, with applications in fields such as Industry 4.0, automotive and heavy machinery.
01
'21
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Sivers Semiconductors News
Sivers Semiconductors to develop CW-WDM MSA compliant DFB laser arrays
Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, will develop CW-WDM MSA compliant laser arrays that support Ayar Labs’ optical I/O solution. Ayar Labs is the leader in integrated optical I/O and is pushing the boundaries for AI, cloud, high-performance computing, 5G, and LIDAR.
01
'21
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Rohm Semiconductors News
ROHM REVISES ITS GREENHOUSE GAS EMISSION REDUCTION TARGETS FOR 2030 TO ACHIEVE A DECARBONIZED SOCIETY
Includes support for the recommendations of the Task Force on Climate-related Financial Disclosures.
01
'21
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Renesas News
Renesas Introduces Industry’s Highest Performance Entry-Line MCUs
New RA6E1 Group Based on Arm® Cortex®-M33 Delivers 200 MHz Performance in Addition to Low Power Performance.
01
'21
Written on
Ease News
What the electronics industry can learn from the automotive sector when it comes to quality measurements
The electronics industry has been under increasing pressure, with the pandemic seeing a rising demand for electrical devices as many people stay at home longer – and at the same time need to work, stay connected with loved ones and be entertained.
30
'21
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Fraunhofer News
