22
'22
Written on
Keysight technologies News
22
'22
Written on
Fraunhofer News
Fraunhofer and Leibniz institutes kick off the "Green ICT @ FMD" competence center
In order to contribute to reducing the carbon footprint of digital technologies through research and development, the Fraunhofer and Leibniz institutes cooperating in the Forschungsfabrik Mikroelektronik Deutschland (Research Factory Microelectronics Germany) are jointly establishing a cross-site competence center for resource-conscious information and communications technology (Green ICT @ FMD).
21
'22
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Power Integrations News
Power Integrations Launches PowerPros Live Video Application-Engineering Support
Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today launched PowerPros℠, a live online video tech support service that enables power-supply designers to talk directly with members of Power Integrations’ applications engineering team 24 hours a day, six days a week, anywhere in the world.
21
'22
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Fraunhofer News
Split manufacturing for trustworthy electronics "Made in Germany"
A consortium of Fraunhofer institutes and well-known German industrial companies is developing a split-manufacturing approach for semiconductor production in the project "Distributed Manufacturing for Novel and Trustworthy Electronics T4T". This will enable the secure assembly of subsystems in Germany and safeguard supply chains.
21
'22
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CEA Leti News
CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast’s Nanosatellite Network
Accelerated Development for Communication Module Enables Low-Cost Connectivity for Devices in Maritime, Oil & Gas, and Transport Sectors.
21
'22
Written on
IDS Imaging Development Systems GmbH
IDS presents six different housing variants
IDS adds numerous new USB3 cameras to its product range. Anyone who needs quickly available industrial cameras for image processing projects is not faced with an easy task due to the worldwide chip shortage.
21
'22
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Tektronix News
Tektronix Adds Powerful New PCI Express® 6.0 Solution to Accelerate the Next Generation of High-Speed Devices
Tektronix delivers fully automated test and validation solution that renders faster test times, higher-quality measurements, and an intuitive user interface.
21
'22
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E+E ELEKTRONIK News
HTE & TEE301 Expand Sensing Element Series for Humidity and Temperature
The new HTE301 and TEE301 models see E+E Elektronik expand its digital sensing element portfolio to include two cost-optimised product variants.
21
'22
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Microchip News
Microchip Unveils Industry’s First Terabit-scale Secure Ethernet PHY Family with Port Aggregation for Enterprise and Cloud Interconnect
META-DX2+ enables OEMs to double router and switch system capacities with 112G PAM4 connectivity for 800G ports, adds encryption and Class C/D precision timing.
20
'22
Written on
Sivers Semiconductors News
