30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Arkema News

Our electroactive polymers showcased in journal SCIENCE

Piezotech^® electroactive polymers offer an infinite range of possibilities in organic electronics. To broaden the knowledge and development of these materials, Arkema collaborates with the world’s leading universities. Recent research led by Pennstate University (USA) was published in the prestigious American scientific journal SCIENCE showcasing these materials of the future.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Anritsu News

Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth^®

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Harwin News

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

Harwin has introduced horizontal backshells for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These backshells ensure a fully EMI/RFI shielded connection for horizontal 1.25mm pitch board-to-cable connections. Previously Gecko EMI/RFI shielding was only available on vertical board-to-cable orientations.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Congatec News

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

Read more…

29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-29T00:00:00+00:00" | date "longDate" }}

WM5G News

Deciphering Open RAN – Exploring the opportunities of open access connectivity in the 5G era

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Read more…

29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-29T00:00:00+00:00" | date "longDate" }}

Digi-Key News

Digi-Key Electronics and Analog Devices to Host Webinar on New Edge Artificial Intelligence Use Cases

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

Read more…

29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-29T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics reveals 2.5V rad-hard digital-to-analog converter for next-generation satellite applications

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Read more…

28 {{ "2022-03-28T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-28T00:00:00+00:00" | date "longDate" }}

Nexperia News

Nexperia officially launches new Dallas design center

Nexperia today announced the official launch of its new design center in Dallas, Texas. Having recently celebrated its 5th anniversary as an independent company, this development marks another major step towards Nexperia’s stated goal of becoming a world leader in essential semiconductors by 2030. First R&D Facility in North America enables entry to power management IC market.

Read more…

28 {{ "2022-03-28T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-28T00:00:00+00:00" | date "longDate" }}

Intel News

Intel Introduces New ATX PSU Specifications

Intel has published the most significant update to industry power supply specifications since the initial ATX 2.0 specs were introduced in 2003. Updated ATX 3.0 specifications unlock the full power and potential of next-generation hardware and upcoming components built for technologies like PCIe Gen 5.0.ATX 3.0 and ATX12VO 2.0 support next-generation hardware power demands.

Read more…

26 {{ "2022-03-26T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-26T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM ESTABLISHES QUICUR: MAXIMIZING THE RESPONSE PERFORMANCE OF POWER SUPPLY ICS

Contributing to reducing power supply circuit design resources by providing stable operation with fewer external components.

Read more…

White Paper

Maximize Your Power System Efficiency — Download Our Whitepaper!

Our electroactive polymers showcased in journal SCIENCE

Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth^®

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

Deciphering Open RAN – Exploring the opportunities of open access connectivity in the 5G era

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Digi-Key Electronics and Analog Devices to Host Webinar on New Edge Artificial Intelligence Use Cases

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

STMicroelectronics reveals 2.5V rad-hard digital-to-analog converter for next-generation satellite applications

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Nexperia officially launches new Dallas design center

Intel Introduces New ATX PSU Specifications

ROHM ESTABLISHES QUICUR: MAXIMIZING THE RESPONSE PERFORMANCE OF POWER SUPPLY ICS

Contributing to reducing power supply circuit design resources by providing stable operation with fewer external components.

International

White Paper

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth® wireless technology.

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Contributing to reducing power supply circuit design resources by providing stable operation with fewer external components.

International

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.