02
'22
Written on
Anritsu News
02
'22
Written on
NEC Corporation News
NTT DOCOMO and NEC are Onboarding 5G SA Core Using Energy-efficient and High-performance AWS Cloud Computing Services
NTT DOCOMO, INC. (DOCOMO) and NEC Corporation (NEC) have launched a proof-of-concept (PoC) testing to run NEC's 5G core network (5GC) service in a hybrid cloud environment that leverages the Amazon Web Services (AWS) cloud using end-to-end cloud-native network architecture.
02
'22
Written on
ST News
Advanced MEMS sensors from STMicroelectronics power-up the Onlife era
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top manufacturer of micro-electro-mechanical systems (MEMS), is introducing its third generation of MEMS sensors.
02
'22
Written on
Sivers Semiconductors News
Sivers Semiconductors and KREEMO Announce the World’s First Metaverse 360o 5G module
KREEMO and Sivers Semiconductors announced that they had succeeded in developing the world’s first high performance 5G module with a 360o coverage for metaverse at MWC 2022.
02
'22
Written on
Paragraf News
Paragraf raises $60m as graphene-based electronics company sets sights on international growth
The funding round, which includes current investors Parkwalk and Amadeus, will enable the business to increase its technological capacity globally and enhance its R&D capabilities.
01
'22
Written on
Proto-Electronics
Proto-Electronics.com, the fast prototyping platform for electronic boards experiences strong growth
Proto-Electronics is a French company, specializing in the rapid, high-quality prototyping of assembled printed circuit boards. With the creation of its online platform www.proto-electronics.com, the goal was to reduce prototype production times which took several weeks and enable companies to accelerate their time-to-market. The company was the first in France at this time to rethink the activity of prototyping assembled PCBs, to offer a fully automated quotation service with a response time of less than ten minutes and a production lead time of 5 days. Today, the platform is well-known throughout Europe (with a delivery to over 26 countries), and mobilizes more than 18000 prototype designers.
01
'22
Written on
Thinesolutions News
THine’s 13MP UVC Camera Kit now runs on Windows, Linux, Mac, Android, Raspberry Pi, and Jetson Platforms
Scalable Ultra-High Resolution and Instant Autofocus Camera is now Available for a Variety of Operating Systems, Single Board Computers, and System on Chip Design Platforms.
01
'22
Written on
Infineon News
Infineon OptiMOS 5 25 V and 30 V solutions in PQFN 2x2 set new form factor, on-state resistance and switching performance standards
Committed to setting new technology standards in discrete power MOSFET technologies, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced its new PQFN 2 x 2 mm 2 OptiMOS 5 25 V and 30 V product family.
01
'22
Written on
Nexans News
NEXANS MARKS A NEW ERA IN HEAT-SHRINKABLE JOINTS, IMPROVING OVERALL RELIABILITY OF POWER NETWORKS
Nexans’ JTS heat-shrinkable joint represents a technical innovation which simplifies the installation process. The new technology improves overall reliability of power distribution networks, shortens the installation time, and reduces joint failure risks.
01
'22
Written on
Tektronix News
