26
'22
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ST News
26
'22
Written on
Snapeda News
Amphenol launches the SnapEDA Viewer with over 21,000 free ready-to-use CAD models for hardware design
Engineers can design faster with free E-CAD and M-CAD models for Amphenol Communication Solutions (ACS) connectors available on the Amphenol.
26
'22
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Sivers Semiconductors News
Sivers Semiconductors exhibits and presents at Wi-Fi World Congress Europe 2022
Sivers Semiconductors AB announces today that its subsidiary Sivers Wireless will participate at Wi-Fi World Congress Europe 2022 in Stockholm, Sweden, with both exhibition and speaker.
26
'22
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Lane Electronics News
Nicomatic high-performance micro-connectors available from Lane Electronics
Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, can supply a wide range of Nicomatic high-performance micro-connectors from stock.
24
'22
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Infineon News
Infineon introduces a new single-stage flyback controller for battery charging applications, enabling hassle-free and scalable designs
Battery-powered appliances, one of the industry’s fastest-growing segments, require energy-efficient, robust, and cost-effective battery charging.
24
'22
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Mouser News
Mouser Dives into the Possibilities of Private 5G Networks in Fifth Empowering Innovation Together Episode
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announces the next chapter of its award-winning Empowering Innovation Together program.
23
'22
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ONSEMI News
onsemi Expands its Silicon Carbide Fab in the Czech Republic
onsemi, a leader in intelligent power and sensing technologies, today celebrated the inauguration of its expanded silicon carbide (SiC) fab in Roznov, Czech Republic. Multiple guests of honor attended the ribbon cutting ceremony led by Ministry of Industry and Trade Section Chief Zbyněk Pokorný, Governor of the Zlín Region Radim Holiš and City Mayor Jiří Pavlica as well as other local governmental dignitaries, signifying the importance of this event and manufacturing of semiconductors in the Czech Republic.
23
'22
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Siemens digital Industry Software News
Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow
Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.
23
'22
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Panasonic Industry News
New 1500V PhotoMOS® relay in miniature DIP5 package from Panasonic targets industrial BMS
The new PhotoMOS® HE relay series from Panasonic Industry Europe offers 5kV I/O isolation and an increased clearance and creepage distance on output side, plus miniature 1-Form-A DIP5 packaging, making it particularly suitable as the switching solution for Battery Management Systems (BMS) in storage systems, charging stations, and numerous other high voltage measurement and infrastructure.
23
'22
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Digi-Key News
