Toshiba Electronics Europe GmbH announces the MG10 Series of massive capacity 20TB HDDs with conventional magnetic recording (CMR) . The 20TB MG10 Series has a 10-disk helium-sealed design that leverages Toshiba’s innovative Flux Control Microwave Assisted Magnetic Recording (FC-MAMR) technology to boost storage capabilities.
ICsense, a TDK Group Company and independent subsidiary that focuses on the supply of application-specific integrated circuits (ASICs) and custom chip design services, has started mass production of a new chemical sensor interface ASIC.
Sivers Semiconductors AB (publ) (“Sivers”) today announces that its business unit, Sivers Wireless, and the Department of Microtechnology and Nanoscience at Chalmers University of Technology (“Chalmers”) will collaborate in research and development of a new generation of power amplifiers.
The new dimension of digitalization is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies and many other digital applications.
New application test automation method accelerates assessment of the quality of experience delivered by the world’s most widely used mobile applications.
NEC Corporation has been selected by the New South Wales (NSW) Telco Authority to build the initial phase of a state-of-the-art 5G innovation lab as part of a new strategic partnership.
DFI, the world’s leading brand in embedded motherboards and industrial computers, was invited to participate in “AMD Datacenter Solutions Day” in September.
Flex Power Modules is announcing the launch of their BMR313 Intermediate Bus Converter (IBC) at the 2022 Open Compute Project global summit in October in San Jose CA 18th of October.
Keystone Electronics expands its product portfolio of ultra-flat surface mount thread inserts with the launch of metric and inch threaded versions. The surface mount inserts are now available in metric thread (M2.5, M3, M4) or inch thread (2-56, 4-40, 6-32). With a protrusion of just 0.3 millimeters above the board, particularly flat integration is possible.