23 {{ "2022-12-23T00:00:00+00:00" | date "MMM" }} '22

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Samsung News

Samsung Electronics Develops Industry’s First 12nm-Class DDR5 DRAM

Set to begin mass production in 2023, Samsung’s new DRAM will advance next-generation computing, data centers and AI applications with industry-leading performance and greater power efficiency.

Read more…

23 {{ "2022-12-23T00:00:00+00:00" | date "MMM" }} '22

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Mouser News

Mouser Electronics Announces Partnership with DS PENSKE for Formula E Season 9

Molex, TTI, KYOCERA AVX Join to Support Drivers Vandoorne and Vergne.

Read more…

22 {{ "2022-12-22T00:00:00+00:00" | date "MMM" }} '22

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Mitsubishi Electric News

Mitsubishi Electric to Expand Range of Ku-band GaN-HEMT Lineup

Mitsubishi Electric Corporation has announced that two new 12.75-13.25 GHz (Low-Ku band) 70W (48.3dBm) gallium-nitride high-electron-mobility transistors (GaN HEMTs) will be added to the company's GaN HEMT lineup for satellite-communication (SATCOM) earth stations.

Read more…

22 {{ "2022-12-22T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-22T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics enhances digital power combination controller for overload stability and regulation

STMicroelectronics’ STNRG011A digital power combination controller for 90W to 300W power supplies features enhanced overload management that ensures accurate output-voltage regulation when overcurrent protection is active.

Read more…

22 {{ "2022-12-22T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-22T00:00:00+00:00" | date "longDate" }}

Teledyne Flir OEM

Thermal By FLIR Program Expands with Industry-First Wearable and Mobile Handset Products for Commercial and Industrial Uses

RealWear introduces Thermal Camera module for the Navigator series, while Ulefone debuts Power Armor 18T phone featuring the Lepton 3.5 thermal camera module.

Read more…

22 {{ "2022-12-22T00:00:00+00:00" | date "MMM" }} '22

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Vicor News

Boeing launches O3b-mPOWER satellite incorporating Vicor radiation-tolerant power modules

Boeing’s O3b mPOWER communication satellite marks a milestone for Vicor Corporation, whose high-performance, radiation-tolerant modules support Boeing’s satellite mission.

Read more…

21 {{ "2022-12-21T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

Infineon at CES 2023: Enabling a sustainable future with smart home, electromobility and IoT security solutions

Infineon Technologies AG today announced that it will highlight the company’s contributions to mitigate climate change and enable digital transformation at CES 2023.

Read more…

21 {{ "2022-12-21T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-21T00:00:00+00:00" | date "longDate" }}

ONSEMI News

onsemi to Showcase Intelligent Solutions at CES 2023

onsemi, a leader in intelligent power and sensing technologies, today announced it will demo the company’s latest innovations at the Consumer Electronics Show (CES) - the center stage for the word’s latest and greatest technology innovations – at the Murano suite 3302, at the Venetian Expo.

Read more…

21 {{ "2022-12-21T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-21T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

Market launch: New Ensenso N models for 3D and robot vision

Upgraded Ensenso 3D camera series now available at IDS.

Read more…

21 {{ "2022-12-21T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-21T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics eases and accelerates user-interface design on STM32 MCUs with new TouchGFX Stock

With the latest version of the TouchGFX software package, STMicroelectronics has made it easier to build great user interfaces (UIs) for applications hosted on STM32 microcontrollers.

Read more…

Case studies

Optimizing Wafer and Die Inspections

White Paper

Delta Electronics: Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Samsung Electronics Develops Industry’s First 12nm-Class DDR5 DRAM

Set to begin mass production in 2023, Samsung’s new DRAM will advance next-generation computing, data centers and AI applications with industry-leading performance and greater power efficiency.

Mouser Electronics Announces Partnership with DS PENSKE for Formula E Season 9

Molex, TTI, KYOCERA AVX Join to Support Drivers Vandoorne and Vergne.

Mitsubishi Electric to Expand Range of Ku-band GaN-HEMT Lineup

Mitsubishi Electric Corporation has announced that two new 12.75-13.25 GHz (Low-Ku band) 70W (48.3dBm) gallium-nitride high-electron-mobility transistors (GaN HEMTs) will be added to the company's GaN HEMT lineup for satellite-communication (SATCOM) earth stations.

STMicroelectronics enhances digital power combination controller for overload stability and regulation

STMicroelectronics’ STNRG011A digital power combination controller for 90W to 300W power supplies features enhanced overload management that ensures accurate output-voltage regulation when overcurrent protection is active.

Thermal By FLIR Program Expands with Industry-First Wearable and Mobile Handset Products for Commercial and Industrial Uses

RealWear introduces Thermal Camera module for the Navigator series, while Ulefone debuts Power Armor 18T phone featuring the Lepton 3.5 thermal camera module.

Boeing launches O3b-mPOWER satellite incorporating Vicor radiation-tolerant power modules

Boeing’s O3b mPOWER communication satellite marks a milestone for Vicor Corporation, whose high-performance, radiation-tolerant modules support Boeing’s satellite mission.

Infineon at CES 2023: Enabling a sustainable future with smart home, electromobility and IoT security solutions

Infineon Technologies AG today announced that it will highlight the company’s contributions to mitigate climate change and enable digital transformation at CES 2023.

onsemi to Showcase Intelligent Solutions at CES 2023

onsemi, a leader in intelligent power and sensing technologies, today announced it will demo the company’s latest innovations at the Consumer Electronics Show (CES) - the center stage for the word’s latest and greatest technology innovations – at the Murano suite 3302, at the Venetian Expo.

Market launch: New Ensenso N models for 3D and robot vision

Upgraded Ensenso 3D camera series now available at IDS.

STMicroelectronics eases and accelerates user-interface design on STM32 MCUs with new TouchGFX Stock

With the latest version of the TouchGFX software package, STMicroelectronics has made it easier to build great user interfaces (UIs) for applications hosted on STM32 microcontrollers.

International