STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.
TDK Corporation expands its solution-focused offerings by announcing the InvenSense VibeSense360 TWS solution suite. VibeSense360 is a comprehensive portfolio of TDK solutions comprised of hardware and software dedicated to the TWS market.
To cope with the boom of e-commerce and direct delivery trends, machine learning is currently greatly integrated into ADAS, public works, intelligent traffic system, and countless warehouse applications. Provided with advanced computing power, extension capability, and high connectivity, NEXCOM’s in-vehicle AI-aided telematics computer, VTC 7260-xC4 is used as the core of vehicles to help deploy applications like smart public transit, smart agriculture/construction, and automated intralogistics.
Keysight Technologies, Inc, a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced it has collaborated with Qualcomm Technologies, Inc, to establish an end-to-end 5G non-terrestrial network connection.
NEXCOM, a leading supplier of network appliances and Industry 4.0 solutions, installed next generation Industrial Control System (ICS) security appliances at its own Smart Factory. ISA 140 is a compact fanless DIN rail box, designed to protect key assets in an industrial setting.
Telit Cinterion, a global leader in the internet of things (IoT), today announced it has completed verification of its 5G FN980 and FN990 series data cards for use with NVIDIA® Jetson AGX Xavier, Jetson AGX Orin and Jetson Orin NX modules.
Infineon Technologies AG and Altia, an international leader in graphical user interface (GUI) design and development tools, has announced their cooperation.
Ams OSRAM, a global leader in optical solutions, today extended its Mira family of pipelined, high- sensitivity, global shutter CMOS image sensors with the launch of the 2.3mm x 2.8mm, 0.5Mpixel Mira050.
CEVA, Inc, the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, has announced that Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, has licensed and deployed the CEVA-XC4500 Communication Processor and CEVA-BX1 Digital Signal Controller in its 3rd generation V2X chipsets, TEKTON3 and SECTON3.
U-blox, a global provider of leading positioning and wireless communication technologies and services, announced the certification of its SARA-R5 series on all the Japan MNOs’ LTE-M networks.