06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Announces Its First Wi-Fi Development Kit with Support for New Matter Protocol

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has announced its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth^® Low-Energy and IEEE 802.15.4 (Thread) products, including products from recently acquired Dialog Semiconductor and Celeno Communications.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Field Master Pro MS2090A Wins Fierce Innovation Award, Telecom Edition in T&M Category

Anritsu Company announces that its Field Master Pro MS2090A real-time spectrum analyzer has been named the winner in the Network Test & Measurement category Fierce Innovation Award, Telecom Edition 2022.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

TDK News

TDK collaborates with Texas Instruments on new i3 Micro Module, the world’s first sensor module with built-in edge AI and wireless mesh connectivity

TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

IAR Systems News

IAR Systems fully supports GigaDevice's automotive-grade MCUs

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon and Green Hills Software collaborate to deliver comprehensive automotive safety and security solutions for the TRAVEO T2G MCU families

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

ONSEMI News

onsemi and Ampt Collaboration Increases Efficiency for Utility Solar Providers

Onsemi’s EliteSiC family of silicon carbide (SiC) technologies enhances performance of Ampt’s DC optimizers.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

ams OSRAM News

Quadric and ams OSRAM collaborate to bring intelligent image sensors’ demonstration

Quadric, an innovator in machine learning processor IP for on-device AI, and ams OSRAM, a global leader in optical solutions, today announced a strategic collaboration to develop integrated sensing modules combining ams OSRAM’s leading edge Mira Family of CMOS sensors for visible and infrared with Quadric’s novel ChimeraTM GPNPU processors.

Read more…

05 {{ "2023-01-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-05T00:00:00+00:00" | date "longDate" }}

TDK News

TDK SmartSound T5838/T5837 MEMS Microphones and SmartSound One Development Platform now available

TDK Corporation announces availability of the InvenSense T5838 and T5837 MEMS microphones, and the SmartSound One Development Platform.

Read more…

05 {{ "2023-01-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-05T00:00:00+00:00" | date "longDate" }}

ONSEMI News

onsemi Silicon Carbide Power Module for Traction Inverters Selected for Hyundai Motor Group’s High Performance Electric Vehicles

Onsemi’s EliteSiC silicon carbide (SiC) modules increase the efficiency and lower the weight of the South Korean automaker’s traction inverters, extending electric vehicle (EV) range and improving performance.

Read more…

Case studies

Optimizing Wafer and Die Inspections

White Paper

Delta Electronics: Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Renesas Announces Its First Wi-Fi Development Kit with Support for New Matter Protocol

Anritsu Field Master Pro MS2090A Wins Fierce Innovation Award, Telecom Edition in T&M Category

Anritsu Company announces that its Field Master Pro MS2090A real-time spectrum analyzer has been named the winner in the Network Test & Measurement category Fierce Innovation Award, Telecom Edition 2022.

TDK collaborates with Texas Instruments on new i3 Micro Module, the world’s first sensor module with built-in edge AI and wireless mesh connectivity

TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.

IAR Systems fully supports GigaDevice's automotive-grade MCUs

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.

Infineon and Green Hills Software collaborate to deliver comprehensive automotive safety and security solutions for the TRAVEO T2G MCU families

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

onsemi and Ampt Collaboration Increases Efficiency for Utility Solar Providers

Onsemi’s EliteSiC family of silicon carbide (SiC) technologies enhances performance of Ampt’s DC optimizers.

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

Quadric and ams OSRAM collaborate to bring intelligent image sensors’ demonstration

TDK SmartSound T5838/T5837 MEMS Microphones and SmartSound One Development Platform now available

TDK Corporation announces availability of the InvenSense T5838 and T5837 MEMS microphones, and the SmartSound One Development Platform.

onsemi Silicon Carbide Power Module for Traction Inverters Selected for Hyundai Motor Group’s High Performance Electric Vehicles

Onsemi’s EliteSiC silicon carbide (SiC) modules increase the efficiency and lower the weight of the South Korean automaker’s traction inverters, extending electric vehicle (EV) range and improving performance.

International

Case studies

White Paper

Anritsu Company announces that its Field Master Pro MS2090A real-time spectrum analyzer has been named the winner in the Network Test & Measurement category Fierce Innovation Award, Telecom Edition 2022.

TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.

IAR Systems®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm® 9.32.1 for GigaDevice’s GD32 MCU series.

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

Onsemi’s EliteSiC family of silicon carbide (SiC) technologies enhances performance of Ampt’s DC optimizers.

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

TDK Corporation announces availability of the InvenSense T5838 and T5837 MEMS microphones, and the SmartSound One Development Platform.

Onsemi’s EliteSiC silicon carbide (SiC) modules increase the efficiency and lower the weight of the South Korean automaker’s traction inverters, extending electric vehicle (EV) range and improving performance.

International

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.