Silicon Quantum Processors on Semiconductor Pilot Lines

Quobly and CEA-Leti have expanded their cooperation to develop silicon-based quantum computing architectures by utilizing the FAMES Pilot Line for advanced semiconductor manufacturing. This collaboration addresses the scaling and integration challenges of silicon spin-qubit technology, targeting high-performance computing and industrial data analysis applications.

Partners and Operational Challenge
The physical scaling of quantum processors requires highly precise manufacturing techniques to isolate, control, and connect individual qubits. Traditional high-volume semiconductor fabrication facilities often lack the flexibility required to test experimental patterning approaches without disrupting standard operations. To resolve this capability gap, Quobly, a developer of silicon-based quantum computers, is partnering with the research institute CEA-Leti. The collaboration provides access to the FAMES Pilot Line, bridging the gap between fundamental quantum physics research and commercial mass production, thereby complementing Quobly's existing industrialization partnership with STMicroelectronics.

Technical Solution and Responsibilities
The technical objective is to mature the QSOI architecture, which integrates silicon spin qubits onto a Fully Depleted Silicon-On-Insulator (FD-SOI) semiconductor platform. Within this framework, CEA-Leti provides access to 300 mm wafer processing equipment and specialized process modules at the FAMES facility. Quobly supplies the quantum processor architectures and defines the specific technology building blocks required for qubit integration and control. The FAMES infrastructure functions as an isolated testing ground for innovative process flows and advanced patterning approaches that are necessary for scaling qubit counts but cannot be efficiently trialed on standard mass-production lines.

Deployment and Implementation
The technology evaluation and process development are executed at the CEA-Leti FAMES facility. Engineers utilize this environment to test new lithography and material deposition techniques required for subsequent generations of quantum processors. Once these experimental process flows are validated and stabilized on the pilot line, the matured technology options are transferred to STMicroelectronics' 300 mm industrial manufacturing infrastructure for volume production. This phased implementation separates experimental process development from stable industrial manufacturing.

Applications and Use Cases
Developing scalable silicon spin qubits on standard FD-SOI platforms targets advanced applications in cryptography, materials science, and complex logistical modeling within the high-performance computing sector. By standardizing quantum processor manufacturing on existing 300 mm CMOS processes, the architecture achieves higher integration densities. This approach reduces the physical footprint of the required cryogenic control systems and improves the operational stability of the qubits by minimizing electromagnetic cross-talk.

Expected Operational Impact
Utilizing a dedicated semiconductor pilot line reduces the lead time for developing high-density quantum processors. By systematically validating new patterning techniques at the FAMES facility, the partnership establishes a scalable manufacturing pathway. This mechanism supports the hardware trajectory from the initial Alloy Pioneer processor, slated for release by the end of 2026, toward large-scale, fault-tolerant architectures targeting one million physical qubits by 2032.

“Access to FAMES adds another capability to this ecosystem, allowing us to explore and mature technology options for the next generations of our quantum processors,” stated Nicolas Daval, Chief Engineering Officer of Quobly.

Edited by Aishwarya Mambet, Induportals Editor, with AI assistance.

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