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TDK Launches 10 μF 100 V Soft-Termination X7R MLCC for 48 V Systems

New 3225-format capacitors combine low ESR, high capacitance and AEC-Q200 qualification for AI servers, humanoid robots, xEVs and industrial equipment.

  www.tdk.com
TDK Launches 10 μF 100 V Soft-Termination X7R MLCC for 48 V Systems

TDK Corporation has developed a new multilayer ceramic capacitor featuring a 100-V rating and a capacitance of 10 microfarads in a 3225 package footprint. The component is engineered to provide soft termination and low resistance for 48-V power lines utilized in artificial intelligence servers, humanoid robots, and electric vehicles.

Electrode Structure and Miniaturization
The transition toward 48-V applications in industrial equipment and electric vehicles requires components capable of minimizing power loss and wire harness weight. Consequently, power line circuits require 100-V-rated multilayer ceramic capacitors with higher capacitance values. While soft-termination products are implemented to mitigate mechanical cracking caused by external stress, the addition of a resin layer typically increases the equivalent series resistance. TDK addresses this limitation in the CN series by utilizing an optimized resin electrode structure. This material configuration maintains a low terminal resistance equivalent to standard products while achieving twice the capacitance of conventional capacitors within the same 3.2 by 2.5 by 2.5-millimeter footprint.

Circuit Reliability and Component Reduction
The combination of high capacitance and low resistance allows engineers to halve the number of multilayer ceramic capacitors required in a mounting area. This reduction directly shrinks the overall circuit footprint and decreases the total component count. In high-density applications such as artificial intelligence servers and automotive electronics, this miniaturization improves overall system reliability. The capacitors are qualified based on the AEC-Q200 standard, verifying their mechanical robustness and electrical stability for demanding automotive environments. Mass production of the component is scheduled to begin in September 2026.

Additional Context:
This section details technical specifications and competitive benchmarking not included in the original product announcement

Within the 100-V multilayer ceramic capacitor market, the TDK CN series competes with soft-termination offerings from manufacturers such as Murata and Samsung Electro-Mechanics. The TDK component utilizes the EIA 1210 or metric 3225 footprint to deliver 10 microfarads of capacitance while maintaining X7R temperature characteristics, which specify a capacitance variation of plus or minus 15 percent across a temperature range of minus 55 to 125 degrees Celsius. Comparable 10-microfarad, 100-V capacitors in the 1210 package size, such as the Murata GCJ32DC72A106 and the Samsung Electro-Mechanics CL32Y106KCV6PNE, typically utilize X7S dielectric formulations. The X7S specification allows for a wider capacitance variation of plus or minus 22 percent over the same temperature range. To achieve X7R stability at 100 V and 10 microfarads, alternative manufacturers often require a larger 2220 package footprint, making the TDK 3225 component an optimized solution for space-constrained circuit designs.

Edited by Natania Lyngdoh, Induportals editor, assisted by AI.

www.tdk.com

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