High-Power Semiconductor Testing Platforms for Wide Bandgap Devices

Cosmic is presenting its latest automated test equipment and power characterization platforms designed for the high-power semiconductor and electric vehicle industries. The testing hardware provides end-to-end validation for wide bandgap devices, bridging laboratory research with high-volume production environments.

Addressing the Transition to Wide Bandgap Semiconductors
The integration of wide bandgap (WBG) materials, specifically silicon carbide (SiC) and gallium nitride (GaN), into automotive and industrial power infrastructures requires advanced validation mechanisms. Unlike traditional silicon, WBG components operate at higher voltages, temperatures, and switching frequencies, necessitating specialized testing equipment to ensure process stability and reliability. To meet these industrial requirements, the newly consolidated hardware division of the company engineered a portfolio of testing solutions covering the entire component lifecycle, from bare wafer known good die (KGD) validation to final packaged module testing. These systems will be exhibited at PCIM Europe in Nuremberg, Germany, from June 9 to 11, 2026.

Power Characterization and Parallel Testing Architectures
For engineering analysis and laboratory characterization, the Quasar200 and Pulsar600 systems measure the performance of WBG power devices. The Quasar200 validates standard silicon, GaN, and low-power SiC modules, while the Pulsar600 accommodates ultra-high current applications such as electric vehicle traction inverters. Transitioning to high-volume manufacturing, the VIP Ultra platform functions as a configurable automatic test equipment (ATE) system. It enables highly parallel testing of Driver ICs, IGBTs, and Power MOSFETs, optimizing throughput without compromising measurement accuracy across the digital supply chain.

Automated Handling and Dynamic Validation Standards
To maximize units per hour (UPH) during mass production, the M2 Turret and Flexible Editions integrate directly with rotary, conveyor, and pick-and-place automated handlers. This integration ensures repeatable testing of both bare dies and packaged discretes on the production floor. Furthermore, to meet the stringent safety requirements of the automotive sector, the DS6 Pulsar dynamic test generator is deployed for mission-critical SiC and GaN validation. The system measures high-speed switching characteristics to guarantee full compliance with established automotive quality standards, specifically AEC-Q101 and AQG 324, ensuring long-term maintainability for electric vehicle powertrains.

Additional Context
This section details technical specifications and competitive benchmarking not included in the original news release.

In the semiconductor automatic test equipment (ATE) market, platforms dedicated to wide bandgap power devices compete with established systems from manufacturers such as Teradyne, Advantest, and Cohu. Standard mixed-signal testers often require external instrumentation add-ons to handle the high voltage (up to 3,000 V) and high current (over 1,000 A) demands of modern SiC and IGBT modules. By embedding these high-power forcing and measurement capabilities directly into systems like the VIP Ultra and Pulsar600, specialized power device testers eliminate the latency associated with external cabling. Furthermore, compliance with the AQG 324 standard—a specific automotive qualification guideline for power modules in power electronics—differentiates testing hardware capable of dynamic stress testing from standard static parametric measurement units.

Edited by Aishwarya Mambet, Induportals Editor, with AI assistance.

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