Power Electronics Solutions for AI and E-Mobility

TDK Corporation will showcase its latest developments in passive components, sensor systems, and power electronics technologies during PCIM 2026, taking place from June 9 to 11 at the NürnbergMesse exhibition center in Nuremberg, Germany. The company’s presentation focuses on improving power density, energy efficiency, thermal management, and system integration across industrial automation, renewable energy, electric mobility, and AI data center infrastructure.

Under the theme “The power in your design,” TDK will demonstrate technologies supporting next-generation energy storage systems, EV charging infrastructure, traction inverters, and high-performance computing power architectures.

High-voltage power conversion for industrial and energy systems
One of the main demonstrations includes an inverter power stack developed with Ingenieurbüro Hoffmann using 3 kV-rated ModCap capacitors from TDK combined with 3.3 kV silicon carbide MOSFETs. The system is designed for energy storage systems and heavy-duty electric vehicles.

TDK will also present a 2L-B6I inverter reference design integrating MKP DC-link film capacitors from the B25697 series with Infineon CoolSiC 2.3 kV silicon carbide MOSFETs. The platform targets wind and solar inverters, battery energy storage systems, DC fast chargers, and solid-state transformers.

The company will further demonstrate an EcoG Powerblock dispenser blade for EV charging applications. The design integrates a single 4-in-1 high-voltage contactor module instead of four discrete contactors, reducing assembly complexity and simplifying maintenance operations.

Another industrial mobility highlight is a 280 kW traction inverter reference design for commercial, construction, and agricultural vehicles developed by Infineon using TDK xEVCap capacitors in the DC link.

Sensor technologies for electric drivetrain systems
TDK will showcase temperature, pressure, Hall-effect, and TMR-based magnetic sensors designed for electric motor control systems. These components support rotor position sensing, current measurement, and resolver replacement in electric drivetrain applications.

The newly introduced TMR TAS magnetic sensors provide analog sensing with high bandwidth and near-zero latency in a compact format. According to TDK, the devices offer an alternative to inductive and resolver-based sensing systems for traction motor applications.

In cooperation with Infineon and Shin-Etsu Silicones Europe, TDK will also present a 300 kW traction inverter demonstrator integrating xEVCap film capacitors and the CarXield EMC filter. The inverter platform uses Infineon EconoDUAL 3 power modules, while Shin-Etsu contributed thermal interface and adhesive materials for mechanical fixation and thermal coupling.

Additional automotive demonstrations include smart aluminum nitride multilayer substrates for thermal management in power semiconductor modules. Aluminum nitride offers higher thermal conductivity than many conventional ceramic substrate materials while maintaining a coefficient of thermal expansion compatible with silicon and silicon carbide semiconductors.

Bidirectional charging and compact power architectures
At the exhibition, visitors will also be able to examine the “Tiny Power Box 2,” an 11 kW bidirectional onboard charger developed by Silicon Austria Labs using multiple TDK CeraLink capacitors. The charger supports both three-phase and single-phase operation and integrates an isolated 14 V DC-DC converter.

TDK will additionally present Infineon’s IDEA traction inverter reference design, which combines xEVCap DC-link capacitors, InsuGate transformer technology for gate driving, and Infineon IDPAK discrete power devices.

Power infrastructure technologies for AI data centers
AI data center infrastructure represents another major focus area for TDK at PCIM 2026. Under the concept “From grid to core,” the company will demonstrate passive components, sensor technologies, and DC-DC converters designed for power supply units, battery energy storage systems, UPS systems, and point-of-load conversion architectures.

TDK will showcase how compact aluminum electrolytic snap-in capacitors support Infineon reference power supplies delivering 8 kW and 12 kW outputs for AI server systems within reduced installation footprints.

The company will also demonstrate MKP DC-link capacitors for modular solid-state transformer architectures and HVC29 high-voltage contactors for 800 V DC power distribution systems.

Additional demonstrations include TDK µPOL converters designed for FPGA, ASIC, and SoC applications. The modular point-of-load solution can be stacked to deliver up to 200 A and is intended for vertical power delivery architectures in AI processing systems.

EMC laboratory expansion and filtering technologies
TDK announced that it is nearing completion of a new EMC laboratory facility in Regensburg, Germany. The accredited site will cover approximately 1,700 square meters, including 1,100 square meters dedicated to laboratories and measurement stations.

At PCIM, the company will also exhibit electromagnetic compatibility absorbers, sine-wave filters rated up to 720 A, and dual-line filters for power electronics applications up to 1500 V and 1600 A.

Technical presentations during the exhibition will address traction inverter capacitor evaluation, thermal-mechanical performance, and technologies supporting the transition toward solid-state transformers.

Additional Context: Technical specifications and competitive benchmarking not included in the original product announcement
The use of silicon carbide MOSFETs in several showcased systems reflects the broader transition within power electronics toward higher switching frequencies, reduced losses, and increased power density compared with conventional IGBT-based architectures. SiC devices are increasingly used in EV charging, renewable energy conversion, and energy storage applications where efficiency and thermal performance are critical.

In the DC-link capacitor market, TDK competes with suppliers including Vishay, KEMET, EPCOS, and Cornell Dubilier. Benchmark criteria typically include ripple current capability, thermal endurance, volumetric efficiency, and operational lifetime under high-frequency switching conditions.

The AI data center power conversion segment is also becoming increasingly competitive, with vendors such as Vicor, Infineon, Monolithic Power Systems, and Delta Electronics developing high-current point-of-load architectures for AI accelerators and high-performance processors. Vertical power delivery systems and modular DC-DC conversion are gaining importance as processor power demands continue to increase.

Edited by Sucithra Mani, Induportals editor – adapted by AI.

www.tdk.com