Compact photorelays for high-temperature test systems

Automated test equipment and automotive electronics increasingly require compact switching components capable of operating under elevated thermal loads. In this context, Toshiba Electronics Europe GmbH introduced a new series of photorelays designed for high-temperature operation and space-constrained PCB designs in test and measurement applications.

Addressing thermal constraints in automotive and test electronics
The new photorelays—TLP3407SRB, TLP3412SRB, TLP3412SRHB and TLP3412SRLB—are designed for operation at temperatures up to 135 °C, exceeding the 125 °C rating typical of comparable devices. This temperature tolerance supports use in thermally demanding environments such as automotive semiconductor test systems, burn-in equipment and electronic test boards.

Such environments are becoming more common as electrification and autonomous driving development increase testing requirements for power electronics and semiconductor components within the automotive data ecosystem.

The devices are housed in an S-VSON4T package measuring approximately 1.45 × 2.0 mm, supporting compact circuit layouts where board space is limited.

Simplifying circuit design through integrated components
The photorelays incorporate integrated input resistors, allowing direct voltage control without the need for external resistors. This reduces component count and simplifies PCB design while freeing board space for additional circuitry.

The compact package also supports high-density mounting, allowing multiple relays to be integrated into space-constrained designs without affecting switching reliability. This is particularly relevant for automated test systems where multiple switching points must be integrated into limited board areas.

Switching characteristics for measurement applications
The TLP3407SRB supports a rated on-state current of up to 1 A. The related devices—TLP3412SRB, TLP3412SRHB and TLP3412SRLB—are designed to provide low on-state resistance and fast switching response, characteristics required in precision measurement and automated switching applications.

These electrical characteristics allow use in applications where stable switching behaviour and predictable response times are necessary for accurate test procedures.

Supporting compact electronic system development
By combining higher temperature tolerance, integrated passive components and compact packaging, the new photorelay series addresses design constraints associated with modern electronic systems.

The devices are intended to support design engineers developing compact and thermally robust electronic platforms, particularly in applications where PCB space optimisation and reliable switching performance are required.

www.toshiba.com

Edited by industrial journalist, Aishwarya Mambet — AI-powered.