Toshiba Launches 135°C-Rated Photorelays

Toshiba Electronic Devices & Storage Corporation has released four voltage-driven photorelays—TLP3407SRB, TLP3412SRB, TLP3412SRHB and TLP3412SRLB—engineered for reliable operation at temperatures up to 135°C. The devices target automotive semiconductor test systems and high-temperature evaluation equipment.

Addressing High-Temperature Automotive Testing
Increasing electrification and autonomous driving functionality have led to higher integration density in automotive electronic control units. As semiconductor operating temperatures rise, validation equipment must withstand similar thermal conditions to ensure accurate reliability testing.

Photorelays used in semiconductor testers, probe cards and burn-in systems are therefore required to maintain stable performance at elevated temperatures. Toshiba’s new devices extend the maximum operating temperature rating from 125°C in previous models to 135°C through optimization of internal component design.

This 10°C increase supports test environments that simulate or exceed real-world automotive operating conditions.

Compact Voltage-Driven Architecture
The new photorelays are voltage-driven types with built-in input resistors. Eliminating the need for external input resistors reduces board component count and simplifies circuit design, particularly in high-density layouts.

All four devices are housed in Toshiba’s S-VSON4T package, measuring approximately 1.45 × 2.0 mm. The compact footprint enables high channel density on probe cards and burn-in boards, where space constraints are critical.

Application in Test and Burn-In Equipment
Automotive semiconductor testers and burn-in systems often require large numbers of photorelays within limited board areas. By combining a 135°C maximum operating temperature with a small package and integrated input resistor, the new photorelays address these design constraints.

Supporting Automotive Semiconductor Qualification
As automotive semiconductor qualification standards increasingly emphasize high-temperature endurance, test infrastructure must match the thermal envelope of the devices under evaluation. Toshiba’s latest photorelays are designed to support this trend by enabling reliable signal switching in demanding thermal environments.

Volume shipments of the four new photorelay models have commenced, targeting applications in automotive semiconductor testing and related high-temperature evaluation equipment.